diff mbox

[V5,2/8] Documentation: devicetree: thermal: da9062/61 TJUNC temperature binding

Message ID ae903f7c3c6325420b90c7f691655d902d137d1f.1481828921.git.stwiss.opensource@diasemi.com (mailing list archive)
State New, archived
Headers show

Commit Message

Steve Twiss Dec. 15, 2016, 7:08 p.m. UTC 
From: Steve Twiss <stwiss.opensource@diasemi.com>

Device tree binding information for DA9062 and DA9061 thermal junction
temperature monitor.

Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
a configurable polling period for over-temperature polling.

This patch also adds two examples, one for DA9062 and one for DA9061. The 
DA9061 example uses a fall-back compatible string for the DA9062.

Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>

---
This patch applies against linux-next and v4.9

v4 -> v5
 - Rebased from v4.8 to v4.9
 - Updates from comments by Eduardo Valentin
 - Replace vendor defined dlg,tjunc-temp-polling-period-ms with standard
   thermal core polling-delay-passive as part of the device tree
   initialisation
 - Remove Acked-by Rob Herring

v3 -> v4
 - NO CODE CHANGE
 - Patch renamed from [PATCH V3 3/9] to [PATCH V4 2/8]
 - Added Acked-by Rob Herring

v2 -> v3
 - Patch renamed from [PATCH V2 03/10] to [PATCH V3 3/9]
 - Changes suggested from other component reviews by Rob Herring:
 - Each compatible line should be a valid combination of compatible
   strings: alter DA9061 line to include the fall back compatible string
   and update the commit message accordingly
 - Add e-mail information about associated patches from this set without
   describing them as being explicitly dependent on this binding

v1 -> v2
 - Patch renamed from [PATCH V1 08/10] to [PATCH V2 03/10] -- these
   changes were made to fix checkpatch warnings caused by the patch
   set dependency order
 - A second example for DA9061 is provided to highlight the use of a
   fall-back compatible option for the DA9062

Hi,

Updates for PATCH V5: the binding has been altered to remove the proposed
dlg,tjunc-temp-polling-period-ms and replaced with the standard thermal
core polling-delay-passive instead. This was in response to a request
from Eduardo Valentin as part of a driver change.

I have also removed a previous Ack by Rob Herring which was valid for
PATCH V3

As previously:
The device driver from this patch set (associated with this binding) is:
  [PATCH V5 7/8] thermal: da9061: TJUNC temperature driver 

Regards,
Steve Twiss, Dialog Semiconductor Ltd.


 .../devicetree/bindings/thermal/da9062-thermal.txt | 37 ++++++++++++++++++++++
 1 file changed, 37 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/da9062-thermal.txt

Comments

Rob Herring (Arm) Dec. 19, 2016, 10:28 p.m. UTC | #1 
On Thu, Dec 15, 2016 at 07:08:39PM +0000, Steve Twiss wrote:
> From: Steve Twiss <stwiss.opensource@diasemi.com>
> 
> Device tree binding information for DA9062 and DA9061 thermal junction
> temperature monitor.
> 
> Binding descriptions for the DA9061 and DA9062 thermal TJUNC supervisor
> device driver, using a single THERMAL_TRIP_HOT trip-wire and allowing for
> a configurable polling period for over-temperature polling.
> 
> This patch also adds two examples, one for DA9062 and one for DA9061. The 
> DA9061 example uses a fall-back compatible string for the DA9062.
> 
> Signed-off-by: Steve Twiss <stwiss.opensource@diasemi.com>
> 
> ---
> This patch applies against linux-next and v4.9
> 
> v4 -> v5
>  - Rebased from v4.8 to v4.9
>  - Updates from comments by Eduardo Valentin
>  - Replace vendor defined dlg,tjunc-temp-polling-period-ms with standard
>    thermal core polling-delay-passive as part of the device tree
>    initialisation
>  - Remove Acked-by Rob Herring

Acked-by: Rob Herring <robh@kernel.org>
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diff mbox

Patch

diff --git a/Documentation/devicetree/bindings/thermal/da9062-thermal.txt b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt
new file mode 100644
index 0000000..08cc72e
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/da9062-thermal.txt
@@ -0,0 +1,37 @@ 
+* Dialog DA9062/61 TJUNC Thermal Module
+
+This module is part of the DA9061/DA9062. For more details about entire
+DA9062 and DA9061 chips see Documentation/devicetree/bindings/mfd/da9062.txt
+
+Junction temperature thermal module uses an interrupt signal to identify
+high THERMAL_TRIP_HOT temperatures for the PMIC device.
+
+Required properties:
+
+- compatible: should be one of the following valid compatible string lines:
+        "dlg,da9061-thermal", "dlg,da9062-thermal"
+        "dlg,da9062-thermal"
+
+Optional properties:
+
+- polling-delay-passive : Specify the polling period, measured in
+    milliseconds, between thermal zone device update checks.
+
+Example: DA9062
+
+	pmic0: da9062@58 {
+		thermal {
+			compatible = "dlg,da9062-thermal";
+			polling-delay-passive = <3000>;
+		};
+	};
+
+Example: DA9061 using a fall-back compatible for the DA9062 onkey driver
+
+	pmic0: da9061@58 {
+		thermal {
+			compatible = "dlg,da9061-thermal", "dlg,da9062-thermal";
+			polling-delay-passive = <3000>;
+		};
+	};
+