| Message ID | 1538332682-12018-2-git-send-email-andy.gross@linaro.org (mailing list archive) |
|---|---|
| State | Not Applicable, archived |
| Delegated to: | Andy Gross |
| Headers | show |
| Series | [GIT,PULL] Qualcomm ARM64 DT updates for 4.20 | expand |
On Sun, Sep 30, 2018 at 8:38 PM Andy Gross <andy.gross@linaro.org> wrote: > > The following changes since commit 5b394b2ddf0347bef56e50c69a58773c94343ff3: > > Linux 4.19-rc1 (2018-08-26 14:11:59 -0700) > > are available in the git repository at: > > git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux.git tags/qcom-arm64-for-4.20 > > for you to fetch changes up to 6db0483cf622fc690e32e0804f8b86061f13962a: > > Revert "dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'" (2018-09-30 12:59:52 -0500) > > ---------------------------------------------------------------- > Qualcomm ARM64 Updates for v4.20 > > * Update Coresight for MSM8916 > * Switch to use mailbox for smp2p and smd on MSM8996 > * Add dispcc, dsp, USB, regulator, and other nodes for SDM845 > * Drop model/compatible from MSM8916 and MSM8996 > * Add compat for db820c > * Add MSM8998 SoC and board support along with associated nodes > * Add RESIN/PON for Qualcomm PM8916 and PM8994 Pulled into next/dt, thanks. There is a small chance that the two reverts end up causing more problems than they help: they might conflict with the patches merged into the iio branch, or they could end up being applied on top of the iio branch and revert the changes during the release. I think it will be fine, but it's obviously better to avoid this. Arnd
On Tue, Oct 02, 2018 at 11:30:29AM +0200, Arnd Bergmann wrote: > On Sun, Sep 30, 2018 at 8:38 PM Andy Gross <andy.gross@linaro.org> wrote: > > > > The following changes since commit 5b394b2ddf0347bef56e50c69a58773c94343ff3: > > > > Linux 4.19-rc1 (2018-08-26 14:11:59 -0700) > > > > are available in the git repository at: > > > > git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux.git tags/qcom-arm64-for-4.20 > > > > for you to fetch changes up to 6db0483cf622fc690e32e0804f8b86061f13962a: > > > > Revert "dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'" (2018-09-30 12:59:52 -0500) > > > > ---------------------------------------------------------------- > > Qualcomm ARM64 Updates for v4.20 > > > > * Update Coresight for MSM8916 > > * Switch to use mailbox for smp2p and smd on MSM8996 > > * Add dispcc, dsp, USB, regulator, and other nodes for SDM845 > > * Drop model/compatible from MSM8916 and MSM8996 > > * Add compat for db820c > > * Add MSM8998 SoC and board support along with associated nodes > > * Add RESIN/PON for Qualcomm PM8916 and PM8994 > > Pulled into next/dt, thanks. > > There is a small chance that the two reverts end up causing more > problems than they help: they might conflict with the patches merged > into the iio branch, or they could end up being applied on top of > the iio branch and revert the changes during the release. I think > it will be fine, but it's obviously better to avoid this. > Agreed, I'll check in on this once -rc1 hits to make sure they weren't removed. Andy
On Fri, Oct 5, 2018 at 7:59 PM Andy Gross <andy.gross@linaro.org> wrote: > > On Tue, Oct 02, 2018 at 11:30:29AM +0200, Arnd Bergmann wrote: > > On Sun, Sep 30, 2018 at 8:38 PM Andy Gross <andy.gross@linaro.org> wrote: > > > > > > The following changes since commit 5b394b2ddf0347bef56e50c69a58773c94343ff3: > > > > > > Linux 4.19-rc1 (2018-08-26 14:11:59 -0700) > > > > > > are available in the git repository at: > > > > > > git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux.git tags/qcom-arm64-for-4.20 > > > > > > for you to fetch changes up to 6db0483cf622fc690e32e0804f8b86061f13962a: > > > > > > Revert "dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'" (2018-09-30 12:59:52 -0500) > > > > > > ---------------------------------------------------------------- > > > Qualcomm ARM64 Updates for v4.20 > > > > > > * Update Coresight for MSM8916 > > > * Switch to use mailbox for smp2p and smd on MSM8996 > > > * Add dispcc, dsp, USB, regulator, and other nodes for SDM845 > > > * Drop model/compatible from MSM8916 and MSM8996 > > > * Add compat for db820c > > > * Add MSM8998 SoC and board support along with associated nodes > > > * Add RESIN/PON for Qualcomm PM8916 and PM8994 > > > > Pulled into next/dt, thanks. > > > > There is a small chance that the two reverts end up causing more > > problems than they help: they might conflict with the patches merged > > into the iio branch, or they could end up being applied on top of > > the iio branch and revert the changes during the release. I think > > it will be fine, but it's obviously better to avoid this. > > > > Agreed, I'll check in on this once -rc1 hits to make sure they weren't removed. Andy, While you acked the tsens thermal DT patches[1] so they could go through the thermal tree[2] to avoid a dependency, Eduardo would prefer the DT changes for tsens to go through the arch tree. To avoid a scenario where these DT changes don't get merged until the next merge window, would you or arm-soc maintainers consider merging them in -rc2 (after the thermal-soc tree gets merged)? For convenience, I've provided just the DT changes with all tags in a separate branch on top of v4.19 here: https://git.linaro.org/people/amit.kucheria/kernel.git/log/?h=up/thermal/tsens-preirq-cleanup-v4 Regards, Amit [1] Here is a reference to the patch series with Andy's acks: https://lore.kernel.org/lkml/cover.1536744310.git.amit.kucheria@linaro.org/T/ [2] Here is a link to Eduardo's tree containing a subset of the above series (I don't yet see a pull request): https://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git/log/?h=linus
On Thu, Oct 25, 2018 at 10:55:32AM +0530, Amit Kucheria wrote: <snip> > Andy, > > While you acked the tsens thermal DT patches[1] so they could go > through the thermal tree[2] to avoid a dependency, Eduardo would > prefer the DT changes for tsens to go through the arch tree. > > To avoid a scenario where these DT changes don't get merged until the > next merge window, would you or arm-soc maintainers consider merging > them in -rc2 (after the thermal-soc tree gets merged)? > > For convenience, I've provided just the DT changes with all tags in a > separate branch on top of v4.19 here: > https://git.linaro.org/people/amit.kucheria/kernel.git/log/?h=up/thermal/tsens-preirq-cleanup-v4 > > Regards, > Amit > [1] Here is a reference to the patch series with Andy's acks: > https://lore.kernel.org/lkml/cover.1536744310.git.amit.kucheria@linaro.org/T/ > [2] Here is a link to Eduardo's tree containing a subset of the above > series (I don't yet see a pull request): > https://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git/log/?h=linus I can just send a pull request for -rc1. No biggie. Andy
On Thu, Oct 25, 2018 at 9:38 PM Andy Gross <andy.gross@linaro.org> wrote: > > On Thu, Oct 25, 2018 at 10:55:32AM +0530, Amit Kucheria wrote: > > <snip> > > > Andy, > > > > While you acked the tsens thermal DT patches[1] so they could go > > through the thermal tree[2] to avoid a dependency, Eduardo would > > prefer the DT changes for tsens to go through the arch tree. > > > > To avoid a scenario where these DT changes don't get merged until the > > next merge window, would you or arm-soc maintainers consider merging > > them in -rc2 (after the thermal-soc tree gets merged)? > > > > For convenience, I've provided just the DT changes with all tags in a > > separate branch on top of v4.19 here: > > https://git.linaro.org/people/amit.kucheria/kernel.git/log/?h=up/thermal/tsens-preirq-cleanup-v4 > > > > Regards, > > Amit > > [1] Here is a reference to the patch series with Andy's acks: > > https://lore.kernel.org/lkml/cover.1536744310.git.amit.kucheria@linaro.org/T/ > > [2] Here is a link to Eduardo's tree containing a subset of the above > > series (I don't yet see a pull request): > > https://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git/log/?h=linus > > I can just send a pull request for -rc1. No biggie. > Thanks Andy. FWIW, the dependency patches landed in Linus' tree.
On Sun, Oct 28, 2018 at 11:24 PM Amit Kucheria <amit.kucheria@linaro.org> wrote: > > On Thu, Oct 25, 2018 at 9:38 PM Andy Gross <andy.gross@linaro.org> wrote: > > > > On Thu, Oct 25, 2018 at 10:55:32AM +0530, Amit Kucheria wrote: > > > > <snip> > > > > > Andy, > > > > > > While you acked the tsens thermal DT patches[1] so they could go > > > through the thermal tree[2] to avoid a dependency, Eduardo would > > > prefer the DT changes for tsens to go through the arch tree. > > > > > > To avoid a scenario where these DT changes don't get merged until the > > > next merge window, would you or arm-soc maintainers consider merging > > > them in -rc2 (after the thermal-soc tree gets merged)? > > > > > > For convenience, I've provided just the DT changes with all tags in a > > > separate branch on top of v4.19 here: > > > https://git.linaro.org/people/amit.kucheria/kernel.git/log/?h=up/thermal/tsens-preirq-cleanup-v4 > > > > > > Regards, > > > Amit > > > [1] Here is a reference to the patch series with Andy's acks: > > > https://lore.kernel.org/lkml/cover.1536744310.git.amit.kucheria@linaro.org/T/ > > > [2] Here is a link to Eduardo's tree containing a subset of the above > > > series (I don't yet see a pull request): > > > https://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal.git/log/?h=linus > > > > I can just send a pull request for -rc1. No biggie. > > > > Thanks Andy. > > FWIW, the dependency patches landed in Linus' tree. Andy, a gentle reminder that the DT patches can now go in safely. Thanks, Amit
The following changes since commit 5b394b2ddf0347bef56e50c69a58773c94343ff3: Linux 4.19-rc1 (2018-08-26 14:11:59 -0700) are available in the git repository at: git://git.kernel.org/pub/scm/linux/kernel/git/agross/linux.git tags/qcom-arm64-for-4.20 for you to fetch changes up to 6db0483cf622fc690e32e0804f8b86061f13962a: Revert "dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'" (2018-09-30 12:59:52 -0500) ---------------------------------------------------------------- Qualcomm ARM64 Updates for v4.20 * Update Coresight for MSM8916 * Switch to use mailbox for smp2p and smd on MSM8996 * Add dispcc, dsp, USB, regulator, and other nodes for SDM845 * Drop model/compatible from MSM8916 and MSM8996 * Add compat for db820c * Add MSM8998 SoC and board support along with associated nodes * Add RESIN/PON for Qualcomm PM8916 and PM8994 ---------------------------------------------------------------- Andy Gross (2): Revert "dt-bindings: iio: vadc: Fix documentation of 'reg'" Revert "dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg'" Bjorn Andersson (10): arm64: dts: qcom: msm8998: Add RPM and regulators for MTP arm64: dts: qcom: msm8998: Add tsens and thermal-zones arm64: dts: qcom: msm8998: Add pmi8998 file arm64: dts: qcom: msm8998: Add smem related nodes arm64: dts: qcom: msm8998: Add firmware node arm64: dts: qcom: msm8998: Add the qfprom node arm64: dts: qcom: msm8998: Add smp2p nodes arm64: dts: qcom: Populate pm8998 with additional nodes arm64: dts: qcom: sdm845: Add adsp, cdsp and slpi smp2p arm64: dts: msm8996: Transition smp2p and smd to mailbox Douglas Anderson (2): arm64: dts: qcom: sdm845-mtp: Add RPMh VRM/XOB regulators arm64: dts: qcom: sdm845-mtp: Add nodes for USB Joonwoo Park (1): arm64: dts: Add msm8998 SoC and MTP board support Manu Gautam (1): arm64: dts: qcom: sdm845: Add USB-related nodes Matthias Kaehlcke (6): dt-bindings: iio: vadc: Fix documentation of 'reg' arm64: dts: qcom: pm8998: Add adc node arm64: dts: sdm845: Add dispcc node dt-bindings: thermal: qcom-spmi-temp-alarm: Fix documentation of 'reg' arm64: dts: qcom: pm8998: Add spmi-temp-alarm node arm64: dts: qcom: pm8998: Add pm8998 thermal zone Niklas Cassel (3): arm64: dts: db820c: Add qcom,apq8096 to compatible string arm64: dts: msm8916: Drop model and compatible arm64: dts: msm8996: Drop model Sibi Sankar (1): arm64: dts: qcom: Add AOSS reset driver node for SDM845 Suzuki K Poulose (1): arm64: dts: msm8916: Update coresight bindings for hardware ports Vinod Koul (4): arm64: dts: qcom: pm8916: Add PON node arm64: dts: qcom: pm8994: Add PON node arm64: dts: qcom: apq8016-sbc: Add resin node arm64: dts: qcom: apq8096-db820c: Add resin node arch/arm64/boot/dts/qcom/Makefile | 1 + arch/arm64/boot/dts/qcom/apq8016-sbc.dtsi | 14 + arch/arm64/boot/dts/qcom/apq8096-db820c.dts | 2 +- arch/arm64/boot/dts/qcom/apq8096-db820c.dtsi | 14 + arch/arm64/boot/dts/qcom/msm8916.dtsi | 98 ++-- arch/arm64/boot/dts/qcom/msm8996.dtsi | 15 +- arch/arm64/boot/dts/qcom/msm8998-mtp.dts | 13 + arch/arm64/boot/dts/qcom/msm8998-mtp.dtsi | 243 ++++++++++ arch/arm64/boot/dts/qcom/msm8998.dtsi | 690 +++++++++++++++++++++++++++ arch/arm64/boot/dts/qcom/pm8916.dtsi | 18 +- arch/arm64/boot/dts/qcom/pm8994.dtsi | 18 + arch/arm64/boot/dts/qcom/pm8998.dtsi | 75 ++- arch/arm64/boot/dts/qcom/pmi8998.dtsi | 40 ++ arch/arm64/boot/dts/qcom/sdm845-mtp.dts | 382 +++++++++++++++ arch/arm64/boot/dts/qcom/sdm845.dtsi | 300 ++++++++++++ 15 files changed, 1858 insertions(+), 65 deletions(-) create mode 100644 arch/arm64/boot/dts/qcom/msm8998-mtp.dts create mode 100644 arch/arm64/boot/dts/qcom/msm8998-mtp.dtsi create mode 100644 arch/arm64/boot/dts/qcom/msm8998.dtsi create mode 100644 arch/arm64/boot/dts/qcom/pmi8998.dtsi