| Message ID | 20200214063443.23589-2-j-keerthy@ti.com (mailing list archive) |
|---|---|
| State | New, archived |
| Delegated to: | Daniel Lezcano |
| Headers | show |
| Series | thermal: k3: Add support for bandgap sensors | expand |
On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote: > Add VTM bindings documentation. In the Voltage Thermal > Management Module(VTM), K3 AM654 supplies a voltage > reference and a temperature sensor feature that are gathered in the band > gap voltage and temperature sensor (VBGAPTS) module. The band > gap provides current and voltage reference for its internal > circuits and other analog IP blocks. The analog-to-digital > converter (ADC) produces an output value that is proportional > to the silicon temperature. > > Signed-off-by: Keerthy <j-keerthy@ti.com> > --- > > Changes in v2: > > * Fixed make dt_binding_check errors. > > .../bindings/thermal/ti,am654-thermal.yaml | 57 +++++++++++++++++++ > 1 file changed, 57 insertions(+) > create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml > My bot found errors running 'make dt_binding_check' on your patch: Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error FATAL ERROR: Unable to parse input tree scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1 Makefile:1263: recipe for target 'dt_binding_check' failed make: *** [dt_binding_check] Error 2 See https://patchwork.ozlabs.org/patch/1237882 Please check and re-submit.
On 19/02/20 1:50 am, Rob Herring wrote: > On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote: >> Add VTM bindings documentation. In the Voltage Thermal >> Management Module(VTM), K3 AM654 supplies a voltage >> reference and a temperature sensor feature that are gathered in the band >> gap voltage and temperature sensor (VBGAPTS) module. The band >> gap provides current and voltage reference for its internal >> circuits and other analog IP blocks. The analog-to-digital >> converter (ADC) produces an output value that is proportional >> to the silicon temperature. >> >> Signed-off-by: Keerthy <j-keerthy@ti.com> >> --- >> >> Changes in v2: >> >> * Fixed make dt_binding_check errors. >> >> .../bindings/thermal/ti,am654-thermal.yaml | 57 +++++++++++++++++++ >> 1 file changed, 57 insertions(+) >> create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml >> > > My bot found errors running 'make dt_binding_check' on your patch: > > Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node > Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error > FATAL ERROR: Unable to parse input tree > scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed > make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1 > Makefile:1263: recipe for target 'dt_binding_check' failed > make: *** [dt_binding_check] Error 2 > > See https://patchwork.ozlabs.org/patch/1237882 > Please check and re-submit. Rob, I am using: Tree: https//github.com/devicetree-org/dt-schema.git branch: master I have make dt_binding_check working for Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts is created without any errors : https://pastebin.ubuntu.com/p/6MkMbKPpbY/ I did not see any errors as the other files erred out. Today i tried with DT_SCHEMA_FILES option and then finally reproduced the errors. It is a bit confusing for the first time users. Now i have it compiled without any errors. Posting v3 in a bit. - Keerthy >
On Wed, Feb 19, 2020 at 1:40 AM Keerthy <j-keerthy@ti.com> wrote: > > > > On 19/02/20 1:50 am, Rob Herring wrote: > > On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote: > >> Add VTM bindings documentation. In the Voltage Thermal > >> Management Module(VTM), K3 AM654 supplies a voltage > >> reference and a temperature sensor feature that are gathered in the band > >> gap voltage and temperature sensor (VBGAPTS) module. The band > >> gap provides current and voltage reference for its internal > >> circuits and other analog IP blocks. The analog-to-digital > >> converter (ADC) produces an output value that is proportional > >> to the silicon temperature. > >> > >> Signed-off-by: Keerthy <j-keerthy@ti.com> > >> --- > >> > >> Changes in v2: > >> > >> * Fixed make dt_binding_check errors. > >> > >> .../bindings/thermal/ti,am654-thermal.yaml | 57 +++++++++++++++++++ > >> 1 file changed, 57 insertions(+) > >> create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml > >> > > > > My bot found errors running 'make dt_binding_check' on your patch: > > > > Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node > > Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error > > FATAL ERROR: Unable to parse input tree > > scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed > > make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1 > > Makefile:1263: recipe for target 'dt_binding_check' failed > > make: *** [dt_binding_check] Error 2 > > > > See https://patchwork.ozlabs.org/patch/1237882 > > Please check and re-submit. > > Rob, > > I am using: > > Tree: https//github.com/devicetree-org/dt-schema.git > branch: master > > I have make dt_binding_check working for > Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml > > Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts > is created without any errors : > > https://pastebin.ubuntu.com/p/6MkMbKPpbY/ > > I did not see any errors as the other files erred out. 'make -k' is your friend. What branch are you on. Only linux-next breaks generally. > Today i tried with DT_SCHEMA_FILES option and then finally reproduced > the errors. It is a bit confusing for the first time users. > > Now i have it compiled without any errors. > > Posting v3 in a bit. > > - Keerthy > > > >
On 2/21/2020 1:58 AM, Rob Herring wrote: > On Wed, Feb 19, 2020 at 1:40 AM Keerthy <j-keerthy@ti.com> wrote: >> >> >> >> On 19/02/20 1:50 am, Rob Herring wrote: >>> On Fri, 14 Feb 2020 12:04:40 +0530, Keerthy wrote: >>>> Add VTM bindings documentation. In the Voltage Thermal >>>> Management Module(VTM), K3 AM654 supplies a voltage >>>> reference and a temperature sensor feature that are gathered in the band >>>> gap voltage and temperature sensor (VBGAPTS) module. The band >>>> gap provides current and voltage reference for its internal >>>> circuits and other analog IP blocks. The analog-to-digital >>>> converter (ADC) produces an output value that is proportional >>>> to the silicon temperature. >>>> >>>> Signed-off-by: Keerthy <j-keerthy@ti.com> >>>> --- >>>> >>>> Changes in v2: >>>> >>>> * Fixed make dt_binding_check errors. >>>> >>>> .../bindings/thermal/ti,am654-thermal.yaml | 57 +++++++++++++++++++ >>>> 1 file changed, 57 insertions(+) >>>> create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml >>>> >>> >>> My bot found errors running 'make dt_binding_check' on your patch: >>> >>> Documentation/devicetree/bindings/display/simple-framebuffer.example.dts:21.16-37.11: Warning (chosen_node_is_root): /example-0/chosen: chosen node must be at root node >>> Error: Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts:21.41-42 syntax error >>> FATAL ERROR: Unable to parse input tree >>> scripts/Makefile.lib:300: recipe for target 'Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml' failed >>> make[1]: *** [Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml] Error 1 >>> Makefile:1263: recipe for target 'dt_binding_check' failed >>> make: *** [dt_binding_check] Error 2 >>> >>> See https://patchwork.ozlabs.org/patch/1237882 >>> Please check and re-submit. >> >> Rob, >> >> I am using: >> >> Tree: https//github.com/devicetree-org/dt-schema.git >> branch: master >> >> I have make dt_binding_check working for >> Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dt.yaml >> >> Documentation/devicetree/bindings/thermal/ti,am654-thermal.example.dts >> is created without any errors : >> >> https://pastebin.ubuntu.com/p/6MkMbKPpbY/ >> >> I did not see any errors as the other files erred out. > > 'make -k' is your friend. > Okay > What branch are you on. Only linux-next breaks generally. linux-next Thanks, Keerthy > >> Today i tried with DT_SCHEMA_FILES option and then finally reproduced >> the errors. It is a bit confusing for the first time users. >> >> Now i have it compiled without any errors. >> >> Posting v3 in a bit. >> >> - Keerthy >> >> >>>
diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml new file mode 100644 index 000000000000..1c26ad8cd505 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml @@ -0,0 +1,57 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Texas Instruments AM654 VTM (DTS) binding + +maintainers: + - Keerthy <j-keerthy@ti.com> + +properties: + compatible: + const: ti,am654-vtm + + reg: + maxItems: 1 + + power-domains: + maxItems: 1 + description: phandle to the associated power domain + + "#thermal-sensor-cells": + const: 1 + +required: + - "#thermal-sensor-cells" + - compatible + - reg + - power-domains + +additionalProperties: false + +examples: + - | + + vtm: wkup_vtm0@42050000 { + compatible = "ti,am654-vtm"; + reg = <0x0 0x42050000 0x0 0x25c>; + power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>; + #thermal-sensor-cells = <1>; + }; + + mpu0_thermal: mpu0_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <500>; /* milliseconds */ + thermal-sensors = <&wkup_vtm0 0>; + + trips { + mpu0_crit: mpu0_crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; + }; +...
Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by: Keerthy <j-keerthy@ti.com> --- Changes in v2: * Fixed make dt_binding_check errors. .../bindings/thermal/ti,am654-thermal.yaml | 57 +++++++++++++++++++ 1 file changed, 57 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml