mbox series

[RFC,v2,0/5] Add support for MBG Thermal monitoring device

Message ID 20241212-mbg-v2-support-v2-0-3249a4339b6e@quicinc.com (mailing list archive)
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Series Add support for MBG Thermal monitoring device | expand

Message

Satya Priya Kakitapalli Dec. 12, 2024, 4:11 p.m. UTC
Add bindings, driver and DT for the Qualcomm's MBG thermal
monitoring device.

Please note that this series is dependent on [1] which adds
ADC5-GEN3 support.

[1] https://lore.kernel.org/linux-arm-msm/c4ca0a4c-e421-4cf6-b073-8e9019400f4c@quicinc.com/

Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@quicinc.com>
---
Satya Priya Kakitapalli (5):
      dt-bindings: thermal: Add MBG thermal monitor support
      dt-bindings: mfd: qcom,spmi-pmic: Add MBG thermal monitor ref
      thermal: qcom: Add support for MBG thermal monitoring
      arm64: dts: qcom: sa8775p-pmics: Add vadc support on SA8775P
      arm64: dts: qcom: sa8775p-pmics: Add support for MBG TM

 .../devicetree/bindings/mfd/qcom,spmi-pmic.yaml    |   4 +
 .../bindings/thermal/qcom-spmi-mbg-tm.yaml         |  86 ++++++++
 arch/arm64/boot/dts/qcom/sa8775p-pmics.dtsi        | 210 ++++++++++++++++++
 drivers/thermal/qcom/Kconfig                       |  11 +
 drivers/thermal/qcom/Makefile                      |   1 +
 drivers/thermal/qcom/qcom-spmi-mbg-tm.c            | 245 +++++++++++++++++++++
 .../iio/adc/qcom,spmi-adc5-gen3-pm8775.h           |  41 ++++
 7 files changed, 598 insertions(+)
---
base-commit: b4ba0e91c6f0de7bebe1b9d209bebe9bd56daa42
change-id: 20241209-mbg-v2-support-63df41a40d53
prerequisite-message-id: <c4ca0a4c-e421-4cf6-b073-8e9019400f4c@quicinc.com>
prerequisite-patch-id: b4aee2e3887f478bdb7ef86519d4e2233a7e8600
prerequisite-patch-id: f1a62cf8dff80669a7b2cac238a033e92853ad38
prerequisite-patch-id: bc6d5a0b2448ed92c77ba0b13fb211ee605b58c7
prerequisite-patch-id: 80bfefa75a9ee0440cc6ad195e424e71bf3c91e9

Best regards,

Comments

Krzysztof Kozlowski Dec. 13, 2024, 8:38 a.m. UTC | #1
On Thu, Dec 12, 2024 at 09:41:19PM +0530, Satya Priya Kakitapalli wrote:
> Add bindings, driver and DT for the Qualcomm's MBG thermal
> monitoring device.
> 
> Please note that this series is dependent on [1] which adds
> ADC5-GEN3 support.

Where is the changelog? What happened here?

Why this is RFC?

Limited review follows (as this is not yet ready).

Best regards,
Krzysztof
Satya Priya Kakitapalli Dec. 13, 2024, 9:20 a.m. UTC | #2
On 12/13/2024 2:08 PM, Krzysztof Kozlowski wrote:
> On Thu, Dec 12, 2024 at 09:41:19PM +0530, Satya Priya Kakitapalli wrote:
>> Add bindings, driver and DT for the Qualcomm's MBG thermal
>> monitoring device.
>>
>> Please note that this series is dependent on [1] which adds
>> ADC5-GEN3 support.
> Where is the changelog? What happened here?


Sorry for missing the change log, please find the summary below:


Changes from v1 to v2:

- Squash the ADC IIO channel bindings(header) and yaml into single patch

- Add new patch [2/5] to add reference to qcom-spmi-mbg-tm.yaml in 
mfd/qcom,spmi-pmic.yaml bindings.

- Use scoped_guard mutex in driver, remove the helper APIs and directly 
use regmap_set/clear_bits() APIs

- Corrected the isr logic to notify the thermal only for lvl1 upper 
threshold violation.  Earlier logic was not handling this fully.

- Update the dt node names and remove the polling delay as it is 0 by 
default.

- Link to v1: 
https://lore.kernel.org/linux-arm-msm/54c3fdd2-f701-4a06-bb3f-41f5a431687a@quicinc.com/


> Why this is RFC?


On v1 I was suggested to mark this as RFC since the dependent changes 
are not yet accepted.


> Limited review follows (as this is not yet ready).
>
> Best regards,
> Krzysztof
>
Krzysztof Kozlowski Dec. 13, 2024, 3:52 p.m. UTC | #3
On 13/12/2024 10:20, Satya Priya Kakitapalli wrote:
>> Why this is RFC?
> 
> 
> On v1 I was suggested to mark this as RFC since the dependent changes 
> are not yet accepted.
> 
Cover letter should explain this, IOW, explain your intentions.

Best regards,
Krzysztof