[v3,0/4] i.MX8MP: more USB3 glue layer feature support

Message

Alexander Stein Jan. 18, 2022, 1:16 p.m. UTC

Thanks everyone for the rfeedback on v2 [1].

This patchset aims to support flags for e.g. over-current active low or port
permanantly attached which are provided in the USB3 glue layer.

In v3 the implementation is moved from USB PHY driver to USB DWC3 glue for
i.MX8MP. The confusing part is that the existing dwc3-imx8mp.c driver references
glue everywhere but is actually using HSIO BLK_CTL, which is a different
hardware block.
The implementation is still backward compatible and be used with device trees
where neither PHY clock nor (new) glue layer base address is provided.

Changes in v3:
* Rename existing member for clarity
* Moved feature implementation from phy-fsl-imx8mq-usb.c to dwc3-imx8mp.c

[1] https://lore.kernel.org/linux-arm-kernel/2245006.irdbgypaU6@steina-w/T/

Alexander Stein (4):
  usb: dwc3: imx8mp: rename iomem base pointer
  dt-bindings: usb: dwc3-imx8mp: Add imx8mp specific flags
  usb: dwc3: imx8mp: Add support for setting SOC specific flags
  arm64: dts: imx8mp: Add memory for USB3 glue layer to usb3 nodes

 .../bindings/usb/fsl,imx8mp-dwc3.yaml         | 38 ++++++--
 arch/arm64/boot/dts/freescale/imx8mp.dtsi     | 20 ++--
 drivers/usb/dwc3/dwc3-imx8mp.c                | 95 +++++++++++++++++--
 3 files changed, 134 insertions(+), 19 deletions(-)