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Mon, 12 Sep 2022 02:16:59 -0700 (PDT) Received: from localhost.localdomain ([2401:4900:1c60:5362:9d7f:2354:1d0a:78e3]) by smtp.gmail.com with ESMTPSA id o65-20020a62cd44000000b0052dbad1ea2esm4857026pfg.6.2022.09.12.02.16.55 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Mon, 12 Sep 2022 02:16:59 -0700 (PDT) From: Bhupesh Sharma To: linux-arm-msm@vger.kernel.org Cc: agross@kernel.org, linux-kernel@vger.kernel.org, linux-pm@vger.kernel.org, daniel.lezcano@linaro.org, devicetree@vger.kernel.org, robh@kernel.org, andersson@kernel.org, rafael@kernel.org, bhupesh.sharma@linaro.org, bhupesh.linux@gmail.com, linux-arm-kernel@lists.infradead.org, catalin.marinas@arm.com Subject: [PATCH 0/3] arm64: qcom: Introduce Qualcomm Cooling Driver suppport Date: Mon, 12 Sep 2022 14:46:40 +0530 Message-Id: <20220912091643.3537857-1-bhupesh.sharma@linaro.org> X-Mailer: git-send-email 2.37.1 MIME-Version: 1.0 X-CRM114-Version: 20100106-BlameMichelson ( TRE 0.8.0 (BSD) ) MR-646709E3 X-CRM114-CacheID: sfid-20220912_021701_438838_7AB04100 X-CRM114-Status: GOOD ( 11.48 ) X-BeenThere: linux-arm-kernel@lists.infradead.org X-Mailman-Version: 2.1.34 Precedence: list List-Id: List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , Sender: "linux-arm-kernel" Errors-To: linux-arm-kernel-bounces+linux-arm-kernel=archiver.kernel.org@lists.infradead.org This patchset introduces the arm64 dts and defconfig changes for introducing the Qualcomm Cooling Driver (aka Qualcomm Thermal Mitigation Driver). Several Qualcomm Snapdragon SoCs have Thermal Mitigation Devices (TMDs) present on various remote subsystem(s) (for e.g. the Compute DSP, aka cDSP), which can be used for several mitigations for remote subsystem(s), including remote processor mitigation, rail voltage restriction etc. At the very top-level, the dts is supposed to describe a TMD node, which should further represent the remote subsystem(s) present on the SoC and further each child of a subsystem should represent the separate cooling devices available on the remote subsystem. Note that this patchset is targeted for the 'linux-arm-msm' tree and the thermal driver/dtbinding patchset/changes targeted for 'linux-pm' tree has been sent as a separate patchset (see [1]). Note that without the PATCH mentioned in [2] this patchset will not compile cleanly. This patchset is based on the latest 'linux-next/master'. [1]. https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-1-bhupesh.sharma@linaro.org/ [2]. https://lore.kernel.org/linux-arm-msm/20220912085049.3517140-4-bhupesh.sharma@linaro.org/ Cc: andersson@kernel.org Cc: robh@kernel.org Cc: daniel.lezcano@linaro.org Cc: rafael@kernel.org Bhupesh Sharma (3): arm64: dts: qcom: sm8150: Add qmi cooling device nodes arm64: dts: qcom: sa8155p-adp: Enable qmi cooling device arm64: defconfig: Enable Qualcomm QMI cooling device driver arch/arm64/boot/dts/qcom/sa8155p-adp.dts | 4 ++ arch/arm64/boot/dts/qcom/sm8150.dtsi | 62 ++++++++++++++++++++++++ arch/arm64/configs/defconfig | 1 + 3 files changed, 67 insertions(+)