| Message ID | 1351674176-20603-3-git-send-email-ldewangan@nvidia.com (mailing list archive) |
|---|---|
| State | New, archived |
| Headers | show |
On 10/31/2012 03:02 AM, Laxman Dewangan wrote: > Enable SLINK4 and connected device in Tegra30 based > platform Cardhu. > Setting maximum spi frequency to 25MHz. > > Spi serial flash is connected on CS1 of SLINK4 on > cardhu platform. > diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt > +winbond Winbond Electronics corp. That should really be a separate patch that goes through the devicetree branch. But I guess it's fairly trivial, so it's not a big deal. > diff --git a/arch/arm/boot/dts/tegra30-cardhu.dtsi b/arch/arm/boot/dts/tegra30-cardhu.dtsi > + spi-flash@1 { > + compatible = "winbond,w25q32"; > + spi-max-frequency = <20000000>; > + reg = <1>; > + }; Since I have an Atmel flash on my board, I see: [ 1.282958] m25p80 spi32766.1: found at25df321a, expected w25q32 [ 1.289103] m25p80 spi32766.1: at25df321a (4096 Kbytes) Is there any way around that (the first log line above)? I suppose the answer is that the DT should reflect the exact flash device that's on the board, and perhaps the bootloader should be adjusting the DT to reflect the correct value. That's probably complex. Do you have any idea whether Atmel or Winbond flash is more common, so we can at least minimize the number of times this message appears?
On Wednesday 31 October 2012 10:14 PM, Stephen Warren wrote: > On 10/31/2012 03:02 AM, Laxman Dewangan wrote: >> Enable SLINK4 and connected device in Tegra30 based >> platform Cardhu. >> Setting maximum spi frequency to 25MHz. >> >> Spi serial flash is connected on CS1 of SLINK4 on >> cardhu platform. >> diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt >> +winbond Winbond Electronics corp. > That should really be a separate patch that goes through the devicetree > branch. But I guess it's fairly trivial, so it's not a big deal. > Yes, I thought that it should be in separate change. I did same on earlier for ISL29028 driver and found that this small change still not get merged. Therefore I clubbed this together as it can go without any issue. I believe it is fine to merge vendor-prefix from any tree. > >> + spi-flash@1 { >> + compatible = "winbond,w25q32"; >> + spi-max-frequency =<20000000>; >> + reg =<1>; >> + }; > Since I have an Atmel flash on my board, I see: > > [ 1.282958] m25p80 spi32766.1: found at25df321a, expected w25q32 > [ 1.289103] m25p80 spi32766.1: at25df321a (4096 Kbytes) > > Is there any way around that (the first log line above)? > > I suppose the answer is that the DT should reflect the exact flash > device that's on the board, and perhaps the bootloader should be > adjusting the DT to reflect the correct value. That's probably complex. > > Do you have any idea whether Atmel or Winbond flash is more common, so > we can at least minimize the number of times this message appears? I observe that most of cardhu have the winbond. All SQA machine has winbond. Also I believe on A04, it is winbond. Better to go with winbond.
diff --git a/Documentation/devicetree/bindings/vendor-prefixes.txt b/Documentation/devicetree/bindings/vendor-prefixes.txt index 9de2b9f..ac2c2c4 100644 --- a/Documentation/devicetree/bindings/vendor-prefixes.txt +++ b/Documentation/devicetree/bindings/vendor-prefixes.txt @@ -51,4 +51,5 @@ ti Texas Instruments via VIA Technologies, Inc. wlf Wolfson Microelectronics wm Wondermedia Technologies, Inc. +winbond Winbond Electronics corp. xlnx Xilinx diff --git a/arch/arm/boot/dts/tegra30-cardhu.dtsi b/arch/arm/boot/dts/tegra30-cardhu.dtsi index b245e6c..b4e0eda 100644 --- a/arch/arm/boot/dts/tegra30-cardhu.dtsi +++ b/arch/arm/boot/dts/tegra30-cardhu.dtsi @@ -275,6 +275,16 @@ }; }; + spi@7000da00 { + status = "okay"; + spi-max-frequency = <25000000>; + spi-flash@1 { + compatible = "winbond,w25q32"; + spi-max-frequency = <20000000>; + reg = <1>; + }; + }; + ahub { i2s@70080400 { status = "okay";
Enable SLINK4 and connected device in Tegra30 based platform Cardhu. Setting maximum spi frequency to 25MHz. Spi serial flash is connected on CS1 of SLINK4 on cardhu platform. Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com> --- Changes from V1: - rename the max freq prop to spi-max-frequency Changes from V2: - make node name to spi@ Changes from V3: - Add winbond spi flash as cs1 for slink4. - Add winbond company name in vendor list. .../devicetree/bindings/vendor-prefixes.txt | 1 + arch/arm/boot/dts/tegra30-cardhu.dtsi | 10 ++++++++++ 2 files changed, 11 insertions(+), 0 deletions(-)