diff mbox series

[24/53] arm64: dts: renesas: r8a77965: Create thermal zone to support IPA

Message ID 7ec67eddfb8e1657d151bfb3eb69c6d3a58ffe06.1561107232.git.horms+renesas@verge.net.au (mailing list archive)
State New, archived
Headers show
Series [GIT,PULL] Renesas ARM64 Based SoC DT Updates for v5.3 | expand

Commit Message

Simon Horman June 21, 2019, 9:16 a.m. UTC 
From: Dien Pham <dien.pham.ry@renesas.com>

Setup a thermal zone driven by SoC temperature sensor.
Create passive trip points and bind them to CPUFreq cooling
device that supports power extension.

In R-Car Gen3, IPA is supported for only one channel
(on H3/M3/M3N SoCs, it is channel THS3). Reason:
  Currently, IPA controls base on only CPU temperature.
  And only one thermal channel is assembled closest
  CPU cores is selected as target of IPA.
  If other channels are used, IPA controlling is not properly.

The A57 cooling device supports 5 cooling states which can be categorised
as follows:

0 & 1) boost (clocking up)
2)     default
3 & 4) cooling (clocking down)

Currently the thermal framework assumes that the default is the minimum,
or in other words there is no provision for handling boost states.
So this patch only describes the upper 3 states, default and cooling.

A single cooling device is described for all A57 CPUs and a separate
cooling device is described for all A53 CPUs. This reflects that physically
there is only one cooling device present for each type of CPU.

This patch improves on an earlier version by:

* Omitting cooling-max-level and cooling-min-level properties which
  are no longer present in mainline as of v4.17
* Removing an unused trip-point0 node sub-property from the trips
  property.
* Using cooling-device indexes such that maximum refers to maximum cooling
  rather than the inverse.
* Defers adding dynamic-power-coefficient properties to a separate patch as
  these are properties of the CPU.

The long signed-off by chain below reflects many revisions, mainly
internal, that this patch has been through.

Signed-off-by: Dien Pham <dien.pham.ry@renesas.com>
Signed-off-by: An Huynh <an.huynh.uj@rvc.renesas.com>
Signed-off-by: Takeshi Kihara <takeshi.kihara.df@renesas.com>
Signed-off-by: Yoshihiro Kaneko <ykaneko0929@gmail.com>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
---
 arch/arm64/boot/dts/renesas/r8a77965.dtsi | 19 +++++++++++++++++++
 1 file changed, 19 insertions(+)
diff mbox series

Patch

diff --git a/arch/arm64/boot/dts/renesas/r8a77965.dtsi b/arch/arm64/boot/dts/renesas/r8a77965.dtsi
index 814ed14b092b..d4aefe2dee94 100644
--- a/arch/arm64/boot/dts/renesas/r8a77965.dtsi
+++ b/arch/arm64/boot/dts/renesas/r8a77965.dtsi
@@ -111,6 +111,7 @@ 
 			power-domains = <&sysc R8A77965_PD_CA57_CPU0>;
 			next-level-cache = <&L2_CA57>;
 			enable-method = "psci";
+			#cooling-cells = <2>;
 			clocks = <&cpg CPG_CORE R8A77965_CLK_Z>;
 			operating-points-v2 = <&cluster0_opp>;
 		};
@@ -2530,6 +2531,7 @@ 
 			polling-delay-passive = <250>;
 			polling-delay = <1000>;
 			thermal-sensors = <&tsc 0>;
+			sustainable-power = <2439>;
 
 			trips {
 				sensor1_crit: sensor1-crit {
@@ -2544,6 +2546,7 @@ 
 			polling-delay-passive = <250>;
 			polling-delay = <1000>;
 			thermal-sensors = <&tsc 1>;
+			sustainable-power = <2439>;
 
 			trips {
 				sensor2_crit: sensor2-crit {
@@ -2558,14 +2561,30 @@ 
 			polling-delay-passive = <250>;
 			polling-delay = <1000>;
 			thermal-sensors = <&tsc 2>;
+			sustainable-power = <2439>;
 
 			trips {
+				target: trip-point1 {
+					/* miliCelsius  */
+					temperature = <100000>;
+					hysteresis = <1000>;
+					type = "passive";
+				};
+
 				sensor3_crit: sensor3-crit {
 					temperature = <120000>;
 					hysteresis = <1000>;
 					type = "critical";
 				};
 			};
+
+			cooling-maps {
+				map0 {
+					trip = <&target>;
+					cooling-device = <&a57_0 2 4>;
+					contribution = <1024>;
+				};
+			};
 		};
 	};