[RFC,v5,0/3] Convert thermal bindings to yaml

Message

Amit Kucheria Feb. 24, 2020, 7:20 a.m. UTC

Hi all,

Here is a series splitting up the thermal bindings into 3 separate bindings
in YAML, one each of the sensor, cooling-device and the thermal zones.
Since I was learning about YAML parsers while creating these bindings,
there are bound to be some issues.

I have to add that the bindings as they exist today, don't really follow
the "describe the hardware" model of devicetree. e.g. the entire
thermal-zone binding is a software abstraction to tie arbitrary,
board-specific trip points to cooling strategies. This doesn't fit well
into the model where the same SoC in two different form-factor devices e.g.
mobile and laptop, will have fairly different thermal profiles and might
benefit from different trip points and mitigation heuristics. I've started
some experiments with moving the thermal zone data to a board-specific
platform data that is used to initialise a "thermal zone driver".

In any case, if we ever move down that path, it'll probably end up being v2
of the binding, so this series is still relevant.

Please help review.

Regards,
Amit


Amit Kucheria (3):
  dt-bindings: thermal: Add yaml bindings for thermal sensors
  dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
  dt-bindings: thermal: Add yaml bindings for thermal zones

 .../thermal/thermal-cooling-devices.yaml      | 114 +++++++
 .../bindings/thermal/thermal-sensor.yaml      |  70 ++++
 .../bindings/thermal/thermal-zones.yaml       | 302 ++++++++++++++++++
 3 files changed, 486 insertions(+)
 create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
 create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
 create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml

Comments

Amit Kucheria Feb. 24, 2020, 7:22 a.m. UTC | #1

Sigh, typo on my part with the version of the series. Will resend with
corrections.

On Mon, Feb 24, 2020 at 12:50 PM Amit Kucheria <[e-mail]> wrote:
>
> Hi all,
>
> Here is a series splitting up the thermal bindings into 3 separate bindings
> in YAML, one each of the sensor, cooling-device and the thermal zones.
> Since I was learning about YAML parsers while creating these bindings,
> there are bound to be some issues.
>
> I have to add that the bindings as they exist today, don't really follow
> the "describe the hardware" model of devicetree. e.g. the entire
> thermal-zone binding is a software abstraction to tie arbitrary,
> board-specific trip points to cooling strategies. This doesn't fit well
> into the model where the same SoC in two different form-factor devices e.g.
> mobile and laptop, will have fairly different thermal profiles and might
> benefit from different trip points and mitigation heuristics. I've started
> some experiments with moving the thermal zone data to a board-specific
> platform data that is used to initialise a "thermal zone driver".
>
> In any case, if we ever move down that path, it'll probably end up being v2
> of the binding, so this series is still relevant.
>
> Please help review.
>
> Regards,
> Amit
>
>
> Amit Kucheria (3):
>   dt-bindings: thermal: Add yaml bindings for thermal sensors
>   dt-bindings: thermal: Add yaml bindings for thermal cooling-devices
>   dt-bindings: thermal: Add yaml bindings for thermal zones
>
>  .../thermal/thermal-cooling-devices.yaml      | 114 +++++++
>  .../bindings/thermal/thermal-sensor.yaml      |  70 ++++
>  .../bindings/thermal/thermal-zones.yaml       | 302 ++++++++++++++++++
>  3 files changed, 486 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml
>  create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml
>
> --
> 2.20.1
>