| Message ID | 20231016-dwc3-refactor-v1-9-ab4a84165470@quicinc.com (mailing list archive) |
|---|---|
| State | Not Applicable |
| Headers | show |
| Series | usb: dwc3: qcom: Flatten dwc3 structure | expand |
On 17/10/2023 05:11, Bjorn Andersson wrote: > The Qualcomm USB block consists of three intertwined parts, the XHCI, > the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents > the Qualcomm glue part, with the other two represented as in a child > node. > > Rename the qcom,dwc3 binding, to represent that this is indeed only the > glue part, to make room for a combined binding. > > The large "select" is included to avoid the schema to be selected for > validation with the upcoming flattened binding - which includes > snps,dwc3 in the compatible. > > Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com> > --- Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Best regards, Krzysztof
On Mon, Oct 16, 2023 at 08:11:17PM -0700, Bjorn Andersson wrote: > The Qualcomm USB block consists of three intertwined parts, the XHCI, > the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents > the Qualcomm glue part, with the other two represented as in a child > node. > > Rename the qcom,dwc3 binding, to represent that this is indeed only the > glue part, to make room for a combined binding. > > The large "select" is included to avoid the schema to be selected for > validation with the upcoming flattened binding - which includes > snps,dwc3 in the compatible. > > Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com> > --- > -title: Qualcomm SuperSpeed DWC3 USB SoC controller > +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue > + > +description: > + This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB > + controller found in many Qualcomm platforms, with the XHCI and DWC3 core This should be "xHCI" throughout the series. > + portions described as a separate child device. > + The combined representation, defined by qcom,dwc3.yaml is preferred. Johan
diff --git a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml b/Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml similarity index 89% rename from Documentation/devicetree/bindings/usb/qcom,dwc3.yaml rename to Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml index 727abe41c422..bec0151b41d2 100644 --- a/Documentation/devicetree/bindings/usb/qcom,dwc3.yaml +++ b/Documentation/devicetree/bindings/usb/qcom,dwc3-glue.yaml @@ -1,14 +1,64 @@ # SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause) %YAML 1.2 --- -$id: http://devicetree.org/schemas/usb/qcom,dwc3.yaml# +$id: http://devicetree.org/schemas/usb/qcom,dwc3-glue.yaml# $schema: http://devicetree.org/meta-schemas/core.yaml# -title: Qualcomm SuperSpeed DWC3 USB SoC controller +title: Qualcomm SuperSpeed DWC3 USB SoC controller glue + +description: + This describes the Qualcomm glue-section of the SuperSpeed DWC3 USB + controller found in many Qualcomm platforms, with the XHCI and DWC3 core + portions described as a separate child device. + The combined representation, defined by qcom,dwc3.yaml is preferred. maintainers: - Wesley Cheng <quic_wcheng@quicinc.com> +select: + properties: + compatible: + items: + - enum: + - qcom,ipq4019-dwc3 + - qcom,ipq5018-dwc3 + - qcom,ipq5332-dwc3 + - qcom,ipq6018-dwc3 + - qcom,ipq8064-dwc3 + - qcom,ipq8074-dwc3 + - qcom,ipq9574-dwc3 + - qcom,msm8953-dwc3 + - qcom,msm8994-dwc3 + - qcom,msm8996-dwc3 + - qcom,msm8998-dwc3 + - qcom,qcm2290-dwc3 + - qcom,qcs404-dwc3 + - qcom,sa8775p-dwc3 + - qcom,sc7180-dwc3 + - qcom,sc7280-dwc3 + - qcom,sc8180x-dwc3 + - qcom,sc8280xp-dwc3 + - qcom,sc8280xp-dwc3-mp + - qcom,sdm660-dwc3 + - qcom,sdm670-dwc3 + - qcom,sdm845-dwc3 + - qcom,sdx55-dwc3 + - qcom,sdx65-dwc3 + - qcom,sdx75-dwc3 + - qcom,sm4250-dwc3 + - qcom,sm6115-dwc3 + - qcom,sm6125-dwc3 + - qcom,sm6350-dwc3 + - qcom,sm6375-dwc3 + - qcom,sm8150-dwc3 + - qcom,sm8250-dwc3 + - qcom,sm8350-dwc3 + - qcom,sm8450-dwc3 + - qcom,sm8550-dwc3 + - const: qcom,dwc3 + required: + - compatible + properties: compatible: items:
The Qualcomm USB block consists of three intertwined parts, the XHCI, the DWC3 core and the Qualcomm DWC3 glue. The exsting binding represents the Qualcomm glue part, with the other two represented as in a child node. Rename the qcom,dwc3 binding, to represent that this is indeed only the glue part, to make room for a combined binding. The large "select" is included to avoid the schema to be selected for validation with the upcoming flattened binding - which includes snps,dwc3 in the compatible. Signed-off-by: Bjorn Andersson <quic_bjorande@quicinc.com> --- .../usb/{qcom,dwc3.yaml => qcom,dwc3-glue.yaml} | 54 +++++++++++++++++++++- 1 file changed, 52 insertions(+), 2 deletions(-)