@@ -44,7 +44,7 @@ comment "Platform Glue Driver Support"
config USB_DWC3_OMAP
tristate "Texas Instruments OMAP5 and similar Platforms"
- depends on EXTCON
+ depends on EXTCON && (ARCH_OMAP2PLUS || COMPILE_TEST)
default USB_DWC3
help
Some platforms from Texas Instruments like OMAP5, DRA7xxx and
@@ -54,6 +54,7 @@ config USB_DWC3_OMAP
config USB_DWC3_EXYNOS
tristate "Samsung Exynos Platform"
+ depends on ARCH_EXYNOS || COMPILE_TEST
default USB_DWC3
help
Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside,
@@ -72,6 +73,7 @@ config USB_DWC3_PCI
config USB_DWC3_KEYSTONE
tristate "Texas Instruments Keystone2 Platforms"
+ depends on ARCH_KEYSTONE || COMPILE_TEST
default USB_DWC3
help
Support of USB2/3 functionality in TI Keystone2 platforms.
Glue layers for the DWC3 driver only make sense on specific platforms. Add dependencies so that they are not built where they aren't needed. Signed-off-by: Jean Delvare <jdelvare@suse.de> Cc: Felipe Balbi <balbi@ti.com> Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org> Cc: WingMan Kwok <w-kwok2@ti.com> --- drivers/usb/dwc3/Kconfig | 4 +++- 1 file changed, 3 insertions(+), 1 deletion(-)