Message ID | 20230926085948.23046-1-quic_priyjain@quicinc.com (mailing list archive) |
---|---|
Headers | show |
Series | Enable tsens and thermal for sa8775p SoC | expand |
On 26.09.2023 10:59, Priyansh Jain wrote: > Adding compatible string in TSENS dt-bindings, device node > for TSENS controller and Thermal zone support > > Changes since v3: "since v3", but this is v2.. but only in the cover letter? Did you mean "in v3"? I guess this is the v3 series, but you accidentally sent the cover letter with "v2" in the title and then resent it separately at [1]? Please consider using the b4 tool [2], it makes such mistakes not happen and simplifies a couple more things for both the submitters and maintainers. [1] https://lore.kernel.org/linux-arm-msm/28473da7-e194-4581-a1d9-6ef574d52ed7@linaro.org/T/#t [2] https://b4.docs.kernel.org/en/latest/index.html Konrad
On Tue, 26 Sep 2023 14:29:46 +0530, Priyansh Jain wrote: > Adding compatible string in TSENS dt-bindings, device node > for TSENS controller and Thermal zone support > > Changes since v3: > - Correct the unit address of tsens node > - Updated tsens nodes in sorted order by address > - Moved thermal zones outside /soc node > > [...] Applied, thanks! [2/2] arm64: dts: qcom: Enable tsens and thermal for sa8775p SoC commit: 4e7870360366b79f8a37ab0809895359105e5b78 Best regards,