| Message ID | 1498102923-68481-2-git-send-email-kevin.wangtao@hisilicon.com (mailing list archive) |
|---|---|
| State | Changes Requested |
| Delegated to: | Eduardo Valentin |
| Headers | show |
Hey Tao, On Thu, Jun 22, 2017 at 11:42:02AM +0800, Tao Wang wrote: > This patch adds the support for thermal sensor of Hi3660 SoC. > this will register sensors for thermal framework and use device > tree to bind cooling device. > > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> > Signed-off-by: Leo Yan <leo.yan@linaro.org> > --- > Changes in v2: > - correct alphabet order > - correct compatible name > > drivers/thermal/Kconfig | 10 ++ > drivers/thermal/Makefile | 1 + > drivers/thermal/hi3660_thermal.c | 198 ++++++++++++++++++++++++++++++++++++++ > 3 files changed, 209 insertions(+) > create mode 100644 drivers/thermal/hi3660_thermal.c > > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > index b5b5fac..ed22a90 100644 > --- a/drivers/thermal/Kconfig > +++ b/drivers/thermal/Kconfig > @@ -192,6 +192,16 @@ config THERMAL_EMULATION > because userland can easily disable the thermal policy by simply > flooding this sysfs node with low temperature values. > > +config HI3660_THERMAL > + tristate "Hi3660 thermal driver" > + depends on ARCH_HISI || COMPILE_TEST > + depends on HAS_IOMEM > + depends on OF > + default y > + help > + Enable this to plug Hi3660 thermal driver into the Linux thermal > + framework. > + > config HISI_THERMAL > tristate "Hisilicon thermal driver" > depends on ARCH_HISI || COMPILE_TEST > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > index 094d703..f29d0a5 100644 > --- a/drivers/thermal/Makefile > +++ b/drivers/thermal/Makefile > @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o > obj-$(CONFIG_ST_THERMAL) += st/ > obj-$(CONFIG_QCOM_TSENS) += qcom/ > obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/ > +obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o > obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o > obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o > obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o > diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c > new file mode 100644 > index 0000000..68fa9018 > --- /dev/null > +++ b/drivers/thermal/hi3660_thermal.c > @@ -0,0 +1,198 @@ > +/* > + * linux/drivers/thermal/hi3660_thermal.c > + * > + * Copyright (c) 2017 Hisilicon Limited. > + * Copyright (c) 2017 Linaro Limited. > + * > + * Author: Tao Wang <kevin.wangtao@hisilicon.com> > + * Author: Leo Yan <leo.yan@linaro.org> > + * > + * This program is free software; you can redistribute it and/or modify > + * it under the terms of the GNU General Public License as published by > + * the Free Software Foundation; version 2 of the License. > + * > + * This program is distributed in the hope that it will be useful, > + * but WITHOUT ANY WARRANTY; without even the implied warranty of > + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the > + * GNU General Public License for more details. > + * > + * You should have received a copy of the GNU General Public License > + * along with this program. If not, see <http://www.gnu.org/licenses/>. > + */ > + > +#include <linux/clk.h> > +#include <linux/device.h> > +#include <linux/err.h> > +#include <linux/io.h> > +#include <linux/kernel.h> > +#include <linux/of.h> > +#include <linux/module.h> > +#include <linux/platform_device.h> > +#include <linux/thermal.h> > + > +#include "thermal_core.h" > + > +#define HW_MAX_SENSORS 4 > +#define HISI_MAX_SENSORS 6 > +#define SENSOR_MAX 4 > +#define SENSOR_AVG 5 > + > +#define ADC_MIN 116 > +#define ADC_MAX 922 > + > +/* hi3660 Thermal Sensor Dev Structure */ > +struct hi3660_thermal_sensor { > + struct hi3660_thermal_data *thermal; > + struct thermal_zone_device *tzd; > + > + uint32_t id; > +}; > + > +struct hi3660_thermal_data { > + struct platform_device *pdev; > + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS]; > + void __iomem *thermal_base; > +}; > + > +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc }; > + > + > +static int hi3660_thermal_get_temp(void *_sensor, int *temp) > +{ > + struct hi3660_thermal_sensor *sensor = _sensor; > + struct hi3660_thermal_data *data = sensor->thermal; > + unsigned int idx; > + int val, average = 0, max = 0; > + > + if (sensor->id < HW_MAX_SENSORS) { > + val = readl(data->thermal_base + sensor_reg_offset[sensor->id]); > + val = clamp_val(val, ADC_MIN, ADC_MAX); > + } else { > + for (idx = 0; idx < HW_MAX_SENSORS; idx++) { > + val = readl(data->thermal_base > + + sensor_reg_offset[idx]); > + val = clamp_val(val, ADC_MIN, ADC_MAX); > + average += val; > + if (val > max) > + max = val; > + } > + > + if (sensor->id == SENSOR_MAX) > + val = max; > + else if (sensor->id == SENSOR_AVG) > + val = average / HW_MAX_SENSORS; > + } > + > + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000; Where do these constants come from (165000 and 40000) can these some how be rearranged and described in DT (coefficients) and using the offset and slope fields? > + > + return 0; > +} > + > +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = { > + .get_temp = hi3660_thermal_get_temp, > +}; > + > +static int hi3660_thermal_register_sensor(struct platform_device *pdev, > + struct hi3660_thermal_data *data, > + struct hi3660_thermal_sensor *sensor, > + int index) > +{ > + int ret = 0; > + > + sensor->id = index; > + sensor->thermal = data; > + > + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev, > + sensor->id, sensor, &hi3660_of_thermal_ops); > + if (IS_ERR(sensor->tzd)) { > + ret = PTR_ERR(sensor->tzd); > + sensor->tzd = NULL; > + } > + > + return ret; > +} > + > +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor, > + bool on) > +{ > + struct thermal_zone_device *tzd = sensor->tzd; > + > + tzd->ops->set_mode(tzd, > + on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED); > +} > + > +static int hi3660_thermal_probe(struct platform_device *pdev) > +{ > + struct device *dev = &pdev->dev; > + struct hi3660_thermal_data *data; > + struct resource *res; > + int ret = 0; > + int i; > + > + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL); > + if (!data) > + return -ENOMEM; > + > + data->pdev = pdev; > + res = platform_get_resource(pdev, IORESOURCE_MEM, 0); > + data->thermal_base = devm_ioremap_resource(dev, res); > + if (IS_ERR(data->thermal_base)) { > + dev_err(dev, "failed get reg base\n"); > + return -ENOMEM; > + } > + > + platform_set_drvdata(pdev, data); > + > + for (i = 0; i < HISI_MAX_SENSORS; ++i) { > + ret = hi3660_thermal_register_sensor(pdev, data, > + &data->sensors[i], i); > + if (ret) > + dev_err(&pdev->dev, > + "failed to register thermal sensor%d: %d\n", > + i, ret); Do you really want to continue if some of the sensors fail to register? > + else > + hi3660_thermal_toggle_sensor(&data->sensors[i], true); > + } > + > + dev_info(&pdev->dev, "Thermal Sensor Loaded\n"); Do you really need the above info in the kernel log? > + return 0; > +} > + > +static int hi3660_thermal_exit(struct platform_device *pdev) > +{ > + struct hi3660_thermal_data *data = platform_get_drvdata(pdev); > + int i; > + > + for (i = 0; i < HISI_MAX_SENSORS; i++) { > + struct hi3660_thermal_sensor *sensor = &data->sensors[i]; > + > + if (!sensor->tzd) > + continue; Why are you considering a valid case of not registering all expected sensors? > + > + hi3660_thermal_toggle_sensor(sensor, false); > + } > + > + return 0; > +} > + > +static const struct of_device_id hi3660_thermal_id_table[] = { > + { .compatible = "hisilicon,hi3660-thermal" }, > + {} > +}; > +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table); > + > +static struct platform_driver hi3660_thermal_driver = { > + .probe = hi3660_thermal_probe, > + .remove = hi3660_thermal_exit, > + .driver = { > + .name = "hi3660_thermal", > + .of_match_table = hi3660_thermal_id_table, > + }, > +}; > + > +module_platform_driver(hi3660_thermal_driver); > + > +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>"); > +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>"); > +MODULE_DESCRIPTION("hi3660 thermal driver"); > +MODULE_LICENSE("GPL v2"); > -- > 1.7.9.5 >
On 2017/7/1 11:06, "Eduardo Valentin" <edubezval@gmail.com> wrote:> > Hey Tao, > > On Thu, Jun 22, 2017 at 11:42:02AM +0800, Tao Wang wrote: > > This patch adds the support for thermal sensor of Hi3660 SoC. > > this will register sensors for thermal framework and use device > > tree to bind cooling device. > > > > Signed-off-by: Tao Wang <kevin.wangtao@hisilicon.com> > > Signed-off-by: Leo Yan <leo.yan@linaro.org> > > --- > > Changes in v2: > > - correct alphabet order > > - correct compatible name > > > > drivers/thermal/Kconfig | 10 ++ > > drivers/thermal/Makefile | 1 + > > drivers/thermal/hi3660_thermal.c | 198 > ++++++++++++++++++++++++++++++++++++++ > > 3 files changed, 209 insertions(+) > > create mode 100644 drivers/thermal/hi3660_thermal.c > > > > diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig > > index b5b5fac..ed22a90 100644 > > --- a/drivers/thermal/Kconfig > > +++ b/drivers/thermal/Kconfig > > @@ -192,6 +192,16 @@ config THERMAL_EMULATION > > because userland can easily disable the thermal policy by simply > > flooding this sysfs node with low temperature values. > > > > +config HI3660_THERMAL > > + tristate "Hi3660 thermal driver" > > + depends on ARCH_HISI || COMPILE_TEST > > + depends on HAS_IOMEM > > + depends on OF > > + default y > > + help > > + Enable this to plug Hi3660 thermal driver into the Linux thermal > > + framework. > > + > > config HISI_THERMAL > > tristate "Hisilicon thermal driver" > > depends on ARCH_HISI || COMPILE_TEST > > diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile > > index 094d703..f29d0a5 100644 > > --- a/drivers/thermal/Makefile > > +++ b/drivers/thermal/Makefile > > @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += > intel_pch_thermal.o > > obj-$(CONFIG_ST_THERMAL) += st/ > > obj-$(CONFIG_QCOM_TSENS) += qcom/ > > obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/ > > +obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o > > obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o > > obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o > > obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o > > diff --git a/drivers/thermal/hi3660_thermal.c > b/drivers/thermal/hi3660_thermal.c > > new file mode 100644 > > index 0000000..68fa9018 > > --- /dev/null > > +++ b/drivers/thermal/hi3660_thermal.c > > @@ -0,0 +1,198 @@ > > +/* > > + * linux/drivers/thermal/hi3660_thermal.c > > + * > > + * Copyright (c) 2017 Hisilicon Limited. > > + * Copyright (c) 2017 Linaro Limited. > > + * > > + * Author: Tao Wang <kevin.wangtao@hisilicon.com> > > + * Author: Leo Yan <leo.yan@linaro.org> > > + * > > + * This program is free software; you can redistribute it and/or modify > > + * it under the terms of the GNU General Public License as published by > > + * the Free Software Foundation; version 2 of the License. > > + * > > + * This program is distributed in the hope that it will be useful, > > + * but WITHOUT ANY WARRANTY; without even the implied warranty of > > + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the > > + * GNU General Public License for more details. > > + * > > + * You should have received a copy of the GNU General Public License > > + * along with this program. If not, see <http://www.gnu.org/licenses/>. > > + */ > > + > > +#include <linux/clk.h> > > +#include <linux/device.h> > > +#include <linux/err.h> > > +#include <linux/io.h> > > +#include <linux/kernel.h> > > +#include <linux/of.h> > > +#include <linux/module.h> > > +#include <linux/platform_device.h> > > +#include <linux/thermal.h> > > + > > +#include "thermal_core.h" > > + > > +#define HW_MAX_SENSORS 4 > > +#define HISI_MAX_SENSORS 6 > > +#define SENSOR_MAX 4 > > +#define SENSOR_AVG 5 > > + > > +#define ADC_MIN 116 > > +#define ADC_MAX 922 > > + > > +/* hi3660 Thermal Sensor Dev Structure */ > > +struct hi3660_thermal_sensor { > > + struct hi3660_thermal_data *thermal; > > + struct thermal_zone_device *tzd; > > + > > + uint32_t id; > > +}; > > + > > +struct hi3660_thermal_data { > > + struct platform_device *pdev; > > + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS]; > > + void __iomem *thermal_base; > > +}; > > + > > +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, > 0xdc }; > > + > > + > > +static int hi3660_thermal_get_temp(void *_sensor, int *temp) > > +{ > > + struct hi3660_thermal_sensor *sensor = _sensor; > > + struct hi3660_thermal_data *data = sensor->thermal; > > + unsigned int idx; > > + int val, average = 0, max = 0; > > + > > + if (sensor->id < HW_MAX_SENSORS) { > > + val = readl(data->thermal_base + sensor_reg_offset[sensor- > >id]); > > + val = clamp_val(val, ADC_MIN, ADC_MAX); > > + } else { > > + for (idx = 0; idx < HW_MAX_SENSORS; idx++) { > > + val = readl(data->thermal_base > > + + sensor_reg_offset[idx]); > > + val = clamp_val(val, ADC_MIN, ADC_MAX); > > + average += val; > > + if (val > max) > > + max = val; > > + } > > + > > + if (sensor->id == SENSOR_MAX) > > + val = max; > > + else if (sensor->id == SENSOR_AVG) > > + val = average / HW_MAX_SENSORS; > > + } > > + > > + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - > 40000; > > Where do these constants come from (165000 and 40000) can these some The sensor's temperature range is -40 to 125, that's the source of the constants. > how > be rearranged and described in DT (coefficients) and using the offset and > slope fields? That make sense, I will reconsider about it. > > > + > > + return 0; > > +} > > + > > +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = { > > + .get_temp = hi3660_thermal_get_temp, > > +}; > > + > > +static int hi3660_thermal_register_sensor(struct platform_device *pdev, > > + struct hi3660_thermal_data *data, > > + struct hi3660_thermal_sensor *sensor, > > + int index) > > +{ > > + int ret = 0; > > + > > + sensor->id = index; > > + sensor->thermal = data; > > + > > + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev- > >dev, > > + sensor->id, sensor, > &hi3660_of_thermal_ops); > > + if (IS_ERR(sensor->tzd)) { > > + ret = PTR_ERR(sensor->tzd); > > + sensor->tzd = NULL; > > + } > > + > > + return ret; > > +} > > + > > +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor > *sensor, > > + bool on) > > +{ > > + struct thermal_zone_device *tzd = sensor->tzd; > > + > > + tzd->ops->set_mode(tzd, > > + on ? THERMAL_DEVICE_ENABLED : > THERMAL_DEVICE_DISABLED); > > +} > > + > > +static int hi3660_thermal_probe(struct platform_device *pdev) > > +{ > > + struct device *dev = &pdev->dev; > > + struct hi3660_thermal_data *data; > > + struct resource *res; > > + int ret = 0; > > + int i; > > + > > + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL); > > + if (!data) > > + return -ENOMEM; > > + > > + data->pdev = pdev; > > + res = platform_get_resource(pdev, IORESOURCE_MEM, 0); > > + data->thermal_base = devm_ioremap_resource(dev, res); > > + if (IS_ERR(data->thermal_base)) { > > + dev_err(dev, "failed get reg base\n"); > > + return -ENOMEM; > > + } > > + > > + platform_set_drvdata(pdev, data); > > + > > + for (i = 0; i < HISI_MAX_SENSORS; ++i) { > > + ret = hi3660_thermal_register_sensor(pdev, data, > > + &data->sensors[i], i); > > + if (ret) > > + dev_err(&pdev->dev, > > + "failed to register thermal sensor%d: %d\n", > > + i, ret); > > Do you really want to continue if some of the sensors fail to register? Yes, because currently we only use one of these sensors, the others will register fail > > > + else > > + hi3660_thermal_toggle_sensor(&data->sensors[i], > true); > > + } > > + > > + dev_info(&pdev->dev, "Thermal Sensor Loaded\n"); > > Do you really need the above info in the kernel log? That should be unnecessary, I will remove it. > > > + return 0; > > +} > > + > > +static int hi3660_thermal_exit(struct platform_device *pdev) > > +{ > > + struct hi3660_thermal_data *data = platform_get_drvdata(pdev); > > + int i; > > + > > + for (i = 0; i < HISI_MAX_SENSORS; i++) { > > + struct hi3660_thermal_sensor *sensor = &data->sensors[i]; > > + > > + if (!sensor->tzd) > > + continue; > > Why are you considering a valid case of not registering all expected > sensors? Because currently we only use one of these sensors. > > + > > + hi3660_thermal_toggle_sensor(sensor, false); > > + } > > + > > + return 0; > > +} > > + > > +static const struct of_device_id hi3660_thermal_id_table[] = { > > + { .compatible = "hisilicon,hi3660-thermal" }, > > + {} > > +}; > > +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table); > > + > > +static struct platform_driver hi3660_thermal_driver = { > > + .probe = hi3660_thermal_probe, > > + .remove = hi3660_thermal_exit, > > + .driver = { > > + .name = "hi3660_thermal", > > + .of_match_table = hi3660_thermal_id_table, > > + }, > > +}; > > + > > +module_platform_driver(hi3660_thermal_driver); > > + > > +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>"); > > +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>"); > > +MODULE_DESCRIPTION("hi3660 thermal driver"); > > +MODULE_LICENSE("GPL v2"); > > -- > > 1.7.9.5 > >
diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig index b5b5fac..ed22a90 100644 --- a/drivers/thermal/Kconfig +++ b/drivers/thermal/Kconfig @@ -192,6 +192,16 @@ config THERMAL_EMULATION because userland can easily disable the thermal policy by simply flooding this sysfs node with low temperature values. +config HI3660_THERMAL + tristate "Hi3660 thermal driver" + depends on ARCH_HISI || COMPILE_TEST + depends on HAS_IOMEM + depends on OF + default y + help + Enable this to plug Hi3660 thermal driver into the Linux thermal + framework. + config HISI_THERMAL tristate "Hisilicon thermal driver" depends on ARCH_HISI || COMPILE_TEST diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile index 094d703..f29d0a5 100644 --- a/drivers/thermal/Makefile +++ b/drivers/thermal/Makefile @@ -55,6 +55,7 @@ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o obj-$(CONFIG_ST_THERMAL) += st/ obj-$(CONFIG_QCOM_TSENS) += qcom/ obj-$(CONFIG_TEGRA_SOCTHERM) += tegra/ +obj-$(CONFIG_HI3660_THERMAL) += hi3660_thermal.o obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o obj-$(CONFIG_GENERIC_ADC_THERMAL) += thermal-generic-adc.o diff --git a/drivers/thermal/hi3660_thermal.c b/drivers/thermal/hi3660_thermal.c new file mode 100644 index 0000000..68fa9018 --- /dev/null +++ b/drivers/thermal/hi3660_thermal.c @@ -0,0 +1,198 @@ +/* + * linux/drivers/thermal/hi3660_thermal.c + * + * Copyright (c) 2017 Hisilicon Limited. + * Copyright (c) 2017 Linaro Limited. + * + * Author: Tao Wang <kevin.wangtao@hisilicon.com> + * Author: Leo Yan <leo.yan@linaro.org> + * + * This program is free software; you can redistribute it and/or modify + * it under the terms of the GNU General Public License as published by + * the Free Software Foundation; version 2 of the License. + * + * This program is distributed in the hope that it will be useful, + * but WITHOUT ANY WARRANTY; without even the implied warranty of + * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the + * GNU General Public License for more details. + * + * You should have received a copy of the GNU General Public License + * along with this program. If not, see <http://www.gnu.org/licenses/>. + */ + +#include <linux/clk.h> +#include <linux/device.h> +#include <linux/err.h> +#include <linux/io.h> +#include <linux/kernel.h> +#include <linux/of.h> +#include <linux/module.h> +#include <linux/platform_device.h> +#include <linux/thermal.h> + +#include "thermal_core.h" + +#define HW_MAX_SENSORS 4 +#define HISI_MAX_SENSORS 6 +#define SENSOR_MAX 4 +#define SENSOR_AVG 5 + +#define ADC_MIN 116 +#define ADC_MAX 922 + +/* hi3660 Thermal Sensor Dev Structure */ +struct hi3660_thermal_sensor { + struct hi3660_thermal_data *thermal; + struct thermal_zone_device *tzd; + + uint32_t id; +}; + +struct hi3660_thermal_data { + struct platform_device *pdev; + struct hi3660_thermal_sensor sensors[HISI_MAX_SENSORS]; + void __iomem *thermal_base; +}; + +unsigned int sensor_reg_offset[HW_MAX_SENSORS] = { 0x1c, 0x5c, 0x9c, 0xdc }; + + +static int hi3660_thermal_get_temp(void *_sensor, int *temp) +{ + struct hi3660_thermal_sensor *sensor = _sensor; + struct hi3660_thermal_data *data = sensor->thermal; + unsigned int idx; + int val, average = 0, max = 0; + + if (sensor->id < HW_MAX_SENSORS) { + val = readl(data->thermal_base + sensor_reg_offset[sensor->id]); + val = clamp_val(val, ADC_MIN, ADC_MAX); + } else { + for (idx = 0; idx < HW_MAX_SENSORS; idx++) { + val = readl(data->thermal_base + + sensor_reg_offset[idx]); + val = clamp_val(val, ADC_MIN, ADC_MAX); + average += val; + if (val > max) + max = val; + } + + if (sensor->id == SENSOR_MAX) + val = max; + else if (sensor->id == SENSOR_AVG) + val = average / HW_MAX_SENSORS; + } + + *temp = ((val - ADC_MIN) * 165000) / (ADC_MAX - ADC_MIN) - 40000; + + return 0; +} + +static struct thermal_zone_of_device_ops hi3660_of_thermal_ops = { + .get_temp = hi3660_thermal_get_temp, +}; + +static int hi3660_thermal_register_sensor(struct platform_device *pdev, + struct hi3660_thermal_data *data, + struct hi3660_thermal_sensor *sensor, + int index) +{ + int ret = 0; + + sensor->id = index; + sensor->thermal = data; + + sensor->tzd = devm_thermal_zone_of_sensor_register(&pdev->dev, + sensor->id, sensor, &hi3660_of_thermal_ops); + if (IS_ERR(sensor->tzd)) { + ret = PTR_ERR(sensor->tzd); + sensor->tzd = NULL; + } + + return ret; +} + +static void hi3660_thermal_toggle_sensor(struct hi3660_thermal_sensor *sensor, + bool on) +{ + struct thermal_zone_device *tzd = sensor->tzd; + + tzd->ops->set_mode(tzd, + on ? THERMAL_DEVICE_ENABLED : THERMAL_DEVICE_DISABLED); +} + +static int hi3660_thermal_probe(struct platform_device *pdev) +{ + struct device *dev = &pdev->dev; + struct hi3660_thermal_data *data; + struct resource *res; + int ret = 0; + int i; + + data = devm_kzalloc(dev, sizeof(*data), GFP_KERNEL); + if (!data) + return -ENOMEM; + + data->pdev = pdev; + res = platform_get_resource(pdev, IORESOURCE_MEM, 0); + data->thermal_base = devm_ioremap_resource(dev, res); + if (IS_ERR(data->thermal_base)) { + dev_err(dev, "failed get reg base\n"); + return -ENOMEM; + } + + platform_set_drvdata(pdev, data); + + for (i = 0; i < HISI_MAX_SENSORS; ++i) { + ret = hi3660_thermal_register_sensor(pdev, data, + &data->sensors[i], i); + if (ret) + dev_err(&pdev->dev, + "failed to register thermal sensor%d: %d\n", + i, ret); + else + hi3660_thermal_toggle_sensor(&data->sensors[i], true); + } + + dev_info(&pdev->dev, "Thermal Sensor Loaded\n"); + return 0; +} + +static int hi3660_thermal_exit(struct platform_device *pdev) +{ + struct hi3660_thermal_data *data = platform_get_drvdata(pdev); + int i; + + for (i = 0; i < HISI_MAX_SENSORS; i++) { + struct hi3660_thermal_sensor *sensor = &data->sensors[i]; + + if (!sensor->tzd) + continue; + + hi3660_thermal_toggle_sensor(sensor, false); + } + + return 0; +} + +static const struct of_device_id hi3660_thermal_id_table[] = { + { .compatible = "hisilicon,hi3660-thermal" }, + {} +}; +MODULE_DEVICE_TABLE(of, hi3660_thermal_id_table); + +static struct platform_driver hi3660_thermal_driver = { + .probe = hi3660_thermal_probe, + .remove = hi3660_thermal_exit, + .driver = { + .name = "hi3660_thermal", + .of_match_table = hi3660_thermal_id_table, + }, +}; + +module_platform_driver(hi3660_thermal_driver); + +MODULE_AUTHOR("Tao Wang <kevin.wangtao@hisilicon.com>"); +MODULE_AUTHOR("Leo Yan <leo.yan@linaro.org>"); +MODULE_DESCRIPTION("hi3660 thermal driver"); +MODULE_LICENSE("GPL v2");