| Message ID | 20210518131408.1310057-1-yangyingliang@huawei.com (mailing list archive) |
|---|---|
| State | New, archived |
| Delegated to: | Daniel Lezcano |
| Headers | show |
| Series | [-next] thermal: thermal_of: Correct struct name __thermal_bind_params | expand |
diff --git a/drivers/thermal/thermal_of.c b/drivers/thermal/thermal_of.c index 5b76f9a1280d..e86389fa1431 100644 --- a/drivers/thermal/thermal_of.c +++ b/drivers/thermal/thermal_of.c @@ -35,7 +35,7 @@ struct __thermal_cooling_bind_param { }; /** - * struct __thermal_bind_param - a match between trip and cooling device + * struct __thermal_bind_params - a match between trip and cooling device * @tcbp: a pointer to an array of cooling devices * @count: number of elements in array * @trip_id: the trip point index
Fix the following make W=1 kernel build warning: drivers/thermal/thermal_of.c:50: warning: expecting prototype for struct __thermal_bind_param. Prototype was for struct __thermal_bind_params instead Signed-off-by: Yang Yingliang <yangyingliang@huawei.com> --- drivers/thermal/thermal_of.c | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-)