| Message ID | 20220912085049.3517140-3-bhupesh.sharma@linaro.org (mailing list archive) |
|---|---|
| State | New, archived |
| Delegated to: | Daniel Lezcano |
| Headers | show |
| Series | thermal: Introduce Qualcomm Cooling Driver suppport | expand |
On Mon, Sep 12, 2022 at 02:20:47PM +0530, Bhupesh Sharma wrote: > Add Kconfig entry & compilation support for Qualcomm qmi cooling driver. > There's no reason for introducing this in a separate patch... > Cc: daniel.lezcano@linaro.org > Cc: rafael@kernel.org > Cc: andersson@kernel.org > Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> > --- > drivers/thermal/qcom/Kconfig | 4 ++++ > drivers/thermal/qcom/Makefile | 2 ++ > drivers/thermal/qcom/qmi_cooling/Kconfig | 14 ++++++++++++++ > drivers/thermal/qcom/qmi_cooling/Makefile | 3 +++ > 4 files changed, 23 insertions(+) > create mode 100644 drivers/thermal/qcom/qmi_cooling/Kconfig > create mode 100644 drivers/thermal/qcom/qmi_cooling/Makefile > > diff --git a/drivers/thermal/qcom/Kconfig b/drivers/thermal/qcom/Kconfig > index ccfd090273c1..d383b2cf4c7f 100644 > --- a/drivers/thermal/qcom/Kconfig > +++ b/drivers/thermal/qcom/Kconfig > @@ -53,3 +53,7 @@ config QCOM_LMH > input from temperature and current sensors. On many newer Qualcomm SoCs > LMh is configured in the firmware and this feature need not be enabled. > However, on certain SoCs like sdm845 LMh has to be configured from kernel. > + > +menu "Qualcomm QMI cooling drivers" > +source "drivers/thermal/qcom/qmi_cooling/Kconfig" ...except for the fact that I missed that you put the new driver in a new directory, with new Kconfig menu etc. Please just name your files appropriately and put them in drivers/thermal/qcom directly. Regards, Bjorn > +endmenu > diff --git a/drivers/thermal/qcom/Makefile b/drivers/thermal/qcom/Makefile > index 0fa2512042e7..61114129827a 100644 > --- a/drivers/thermal/qcom/Makefile > +++ b/drivers/thermal/qcom/Makefile > @@ -1,4 +1,6 @@ > # SPDX-License-Identifier: GPL-2.0-only > +obj-$(CONFIG_QCOM_QMI_COOLING) += qmi_cooling/ > + > obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o > > qcom_tsens-y += tsens.o tsens-v2.o tsens-v1.o tsens-v0_1.o \ > diff --git a/drivers/thermal/qcom/qmi_cooling/Kconfig b/drivers/thermal/qcom/qmi_cooling/Kconfig > new file mode 100644 > index 000000000000..96488181cd5f > --- /dev/null > +++ b/drivers/thermal/qcom/qmi_cooling/Kconfig > @@ -0,0 +1,14 @@ > +# SPDX-License-Identifier: GPL-2.0-only > + > +config QCOM_QMI_COOLING > + tristate "Qualcomm QMI cooling drivers" > + depends on QCOM_RPROC_COMMON > + depends on ARCH_QCOM || COMPILE_TEST > + select QCOM_QMI_HELPERS > + help > + This enables the remote subsystem cooling devices. These cooling > + devices will be used by Qualcomm chipset to place various remote > + subsystem mitigations like remote processor passive mitigation, > + remote subsystem voltage restriction at low temperatures etc. > + The QMI cooling device will interface with remote subsystem > + using Qualcomm remoteproc interface. > diff --git a/drivers/thermal/qcom/qmi_cooling/Makefile b/drivers/thermal/qcom/qmi_cooling/Makefile > new file mode 100644 > index 000000000000..ea6cb3c8adb0 > --- /dev/null > +++ b/drivers/thermal/qcom/qmi_cooling/Makefile > @@ -0,0 +1,3 @@ > +# SPDX-License-Identifier: GPL-2.0-only > +obj-$(CONFIG_QCOM_QMI_COOLING) += qcom_cooling.o > +qcom_cooling-y += qcom_tmd_services.o qcom_qmi_cooling.o > -- > 2.37.1 >
diff --git a/drivers/thermal/qcom/Kconfig b/drivers/thermal/qcom/Kconfig index ccfd090273c1..d383b2cf4c7f 100644 --- a/drivers/thermal/qcom/Kconfig +++ b/drivers/thermal/qcom/Kconfig @@ -53,3 +53,7 @@ config QCOM_LMH input from temperature and current sensors. On many newer Qualcomm SoCs LMh is configured in the firmware and this feature need not be enabled. However, on certain SoCs like sdm845 LMh has to be configured from kernel. + +menu "Qualcomm QMI cooling drivers" +source "drivers/thermal/qcom/qmi_cooling/Kconfig" +endmenu diff --git a/drivers/thermal/qcom/Makefile b/drivers/thermal/qcom/Makefile index 0fa2512042e7..61114129827a 100644 --- a/drivers/thermal/qcom/Makefile +++ b/drivers/thermal/qcom/Makefile @@ -1,4 +1,6 @@ # SPDX-License-Identifier: GPL-2.0-only +obj-$(CONFIG_QCOM_QMI_COOLING) += qmi_cooling/ + obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o qcom_tsens-y += tsens.o tsens-v2.o tsens-v1.o tsens-v0_1.o \ diff --git a/drivers/thermal/qcom/qmi_cooling/Kconfig b/drivers/thermal/qcom/qmi_cooling/Kconfig new file mode 100644 index 000000000000..96488181cd5f --- /dev/null +++ b/drivers/thermal/qcom/qmi_cooling/Kconfig @@ -0,0 +1,14 @@ +# SPDX-License-Identifier: GPL-2.0-only + +config QCOM_QMI_COOLING + tristate "Qualcomm QMI cooling drivers" + depends on QCOM_RPROC_COMMON + depends on ARCH_QCOM || COMPILE_TEST + select QCOM_QMI_HELPERS + help + This enables the remote subsystem cooling devices. These cooling + devices will be used by Qualcomm chipset to place various remote + subsystem mitigations like remote processor passive mitigation, + remote subsystem voltage restriction at low temperatures etc. + The QMI cooling device will interface with remote subsystem + using Qualcomm remoteproc interface. diff --git a/drivers/thermal/qcom/qmi_cooling/Makefile b/drivers/thermal/qcom/qmi_cooling/Makefile new file mode 100644 index 000000000000..ea6cb3c8adb0 --- /dev/null +++ b/drivers/thermal/qcom/qmi_cooling/Makefile @@ -0,0 +1,3 @@ +# SPDX-License-Identifier: GPL-2.0-only +obj-$(CONFIG_QCOM_QMI_COOLING) += qcom_cooling.o +qcom_cooling-y += qcom_tmd_services.o qcom_qmi_cooling.o
Add Kconfig entry & compilation support for Qualcomm qmi cooling driver. Cc: daniel.lezcano@linaro.org Cc: rafael@kernel.org Cc: andersson@kernel.org Signed-off-by: Bhupesh Sharma <bhupesh.sharma@linaro.org> --- drivers/thermal/qcom/Kconfig | 4 ++++ drivers/thermal/qcom/Makefile | 2 ++ drivers/thermal/qcom/qmi_cooling/Kconfig | 14 ++++++++++++++ drivers/thermal/qcom/qmi_cooling/Makefile | 3 +++ 4 files changed, 23 insertions(+) create mode 100644 drivers/thermal/qcom/qmi_cooling/Kconfig create mode 100644 drivers/thermal/qcom/qmi_cooling/Makefile