Message ID | 20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org (mailing list archive) |
---|---|
State | New |
Delegated to: | Daniel Lezcano |
Headers | show
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Fri, 05 Jul 2024 02:52:12 -0700 (PDT) Received: from [127.0.1.1] ([178.197.219.137]) by smtp.gmail.com with ESMTPSA id 5b1f17b1804b1-4264a1d1650sm55528995e9.2.2024.07.05.02.52.10 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Fri, 05 Jul 2024 02:52:12 -0700 (PDT) From: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Date: Fri, 05 Jul 2024 11:51:29 +0200 Subject: [PATCH RESEND 10/22] dt-bindings: thermal: qcom-spmi-adc-tm5: reference thermal-sensor schema Precedence: bulk X-Mailing-List: linux-pm@vger.kernel.org List-Id: <linux-pm.vger.kernel.org> List-Subscribe: <mailto:linux-pm+subscribe@vger.kernel.org> List-Unsubscribe: <mailto:linux-pm+unsubscribe@vger.kernel.org> MIME-Version: 1.0 Content-Type: text/plain; charset="utf-8" Content-Transfer-Encoding: 7bit Message-Id: <20240705-dt-bindings-thermal-allof-v1-10-554061b52fbc@linaro.org> References: <20240705-dt-bindings-thermal-allof-v1-0-554061b52fbc@linaro.org> In-Reply-To: <20240705-dt-bindings-thermal-allof-v1-0-554061b52fbc@linaro.org> To: Daniel Lezcano <daniel.lezcano@linaro.org>, Zhang Rui <rui.zhang@intel.com>, Rob Herring <robh@kernel.org>, Conor Dooley <conor+dt@kernel.org>, Guillaume La Roque <glaroque@baylibre.com>, Krzysztof Kozlowski <krzk+dt@kernel.org>, Chen-Yu Tsai <wens@csie.org>, Fabio Estevam <festevam@gmail.com> Cc: linux-pm@vger.kernel.org, linux-samsung-soc@vger.kernel.org, devicetree@vger.kernel.org, linux-arm-kernel@lists.infradead.org, linux-kernel@vger.kernel.org, linux-amlogic@lists.infradead.org, linux-sunxi@lists.linux.dev, imx@lists.linux.dev, linux-tegra@vger.kernel.org, linux-arm-msm@vger.kernel.org, linux-renesas-soc@vger.kernel.org, linux-rockchip@lists.infradead.org, linux-stm32@st-md-mailman.stormreply.com, Florian Fainelli <f.fainelli@gmail.com>, linux-rpi-kernel@lists.infradead.org, linux-mediatek@lists.infradead.org, Dmitry Baryshkov <dmitry.baryshkov@linaro.org>, Conor Dooley <conor.dooley@microchip.com>, Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> X-Mailer: b4 0.14.0 X-Developer-Signature: v=1; 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dt-bindings: thermal: few cleanups
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diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml index d9d2657287cb..4470a5942fb2 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml @@ -8,6 +8,8 @@ title: Qualcomm's SPMI PMIC ADC Thermal Monitoring maintainers: - Dmitry Baryshkov <dmitry.baryshkov@linaro.org> +$ref: thermal-sensor.yaml# + properties: compatible: enum: @@ -23,9 +25,6 @@ properties: "#thermal-sensor-cells": const: 1 - description: - Number of cells required to uniquely identify the thermal sensors. Since - we have multiple sensors this is set to 1 "#address-cells": const: 1 @@ -159,9 +158,8 @@ required: - interrupts - "#address-cells" - "#size-cells" - - "#thermal-sensor-cells" -additionalProperties: false +unevaluatedProperties: false examples: - |