From patchwork Mon Feb 24 07:20:25 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11399455 Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id 0D9D8159A for ; Mon, 24 Feb 2020 07:20:38 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id E045520714 for ; Mon, 24 Feb 2020 07:20:37 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="GBymmIvH" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1727218AbgBXHUg (ORCPT ); Mon, 24 Feb 2020 02:20:36 -0500 Received: from mail-pg1-f196.google.com ([209.85.215.196]:35917 "EHLO mail-pg1-f196.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1726709AbgBXHUg (ORCPT ); Mon, 24 Feb 2020 02:20:36 -0500 Received: by mail-pg1-f196.google.com with SMTP id d9so4673220pgu.3 for ; Sun, 23 Feb 2020 23:20:35 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=hYyHTVUj+djldG9B+Pq0Lr60baNa5Q3EKWfIUDYwvYI=; b=GBymmIvHQzBNttVSYVv5zYioRedO0qpWmadZ/xeDiAucUdzezkn4nxbRFUhmMKf00D M17Xo2FZ5pHqokQN78baFSHtO9nZlinJUCND5Tx+CFDRe7zUGjnuROC9dk57mGzeOw3q XESDdIvXfpEyX8U2CgweKbYC5mpJfvkzEby+4DNo02a9SXZepISxcRuOM3lnERl9+135 +i95uUJynJ1Dr80pEIK9k6oP+C6kuIHOJ+JZwWTCX3EMYQP317WV3pJxJah7N4x2RITG 5QOSnApOEjcT+tZyYyo/XEgsfNcknaQRWmF//fvBCv/yupJ3LHDDiuck/yokcmCgMUQ3 LKRQ== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=hYyHTVUj+djldG9B+Pq0Lr60baNa5Q3EKWfIUDYwvYI=; b=BlU6LgAoSuMb5Kq6sz4fP93+LfeTMYCFnxfSu7fFSzUEZR1E+ijjUi3/oaMtg+m/6x L3lqtxKyfh2NNbhv6LtkBXZo4/2GlgfynJTu4k56Y/m8SXijuz4Emn7yjMJV7LWuA947 178B7WdENqShpyP5OHU3AFVZB94PDsr3uAKzh99H1URHy2n99ReSTwdlJe+v5JBT6PWa txBW28pNQ15Nd/hIjjSoXRWAu1LCn/AAOH5+OsoNvQKhDVrWla62w7KVzK4VRZqIHW09 bbri6cSYp6yHQvK5/GYEM6yueeVtHZNAY3qXTBGpuYCxWnOGXhtAP86tuKx4yL1Y7Oa9 CJNQ== X-Gm-Message-State: APjAAAUOT8EsGDaZ5O0Z+68iwlvoiceXyIj7KFsjF9AY8VqEzW+r1gnt OKaTG7giF7soJM0l7LHooz5DlA== X-Google-Smtp-Source: APXvYqwvFRvxv26RRNm47hP/leNjWMWg+BVjynUNfAbz416mcQ1C+oJMs4zsslhD7uvy/ML9iVbIUw== X-Received: by 2002:a63:82c2:: with SMTP id w185mr16660957pgd.382.1582528835465; Sun, 23 Feb 2020 23:20:35 -0800 (PST) Received: from localhost ([45.127.44.57]) by smtp.gmail.com with ESMTPSA id l69sm11142310pgd.1.2020.02.23.23.20.34 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sun, 23 Feb 2020 23:20:34 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [RFC PATCH v5 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Date: Mon, 24 Feb 2020 12:50:25 +0530 Message-Id: <11f9128efef92b427d93a563d5b53b62c4c01888.1582527752.git.amit.kucheria@linaro.org> X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Sender: linux-arm-msm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-arm-msm@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria --- .../bindings/thermal/thermal-sensor.yaml | 70 +++++++++++++++++++ 1 file changed, 70 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 000000000000..ac32f54f2f98 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,70 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + }; +... From patchwork Mon Feb 24 07:20:26 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11399463 Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id AB437924 for ; Mon, 24 Feb 2020 07:20:50 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 8080A2080D for ; Mon, 24 Feb 2020 07:20:50 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="tX4PPsoA" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S1727278AbgBXHUm (ORCPT ); Mon, 24 Feb 2020 02:20:42 -0500 Received: from mail-pf1-f194.google.com ([209.85.210.194]:43169 "EHLO mail-pf1-f194.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S1727276AbgBXHUl (ORCPT ); Mon, 24 Feb 2020 02:20:41 -0500 Received: by mail-pf1-f194.google.com with SMTP id s1so4876622pfh.10 for ; Sun, 23 Feb 2020 23:20:39 -0800 (PST) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=d17BUbT9BeIhozRgLya99QrlVVsu5JDoV05HFzpYDyI=; b=tX4PPsoAZ93qYdTGJqfLDnzMCWiEL3N5LumrMh2+TNF6m+7oLL1F/EyrLxp8necb50 lRiepTn9LHb9aWKxBomyH/Iaa5/v51oKIB//XnqfstKAsBTut8pSKd8fdWs8xwQHuUzg 8o8wlUgtf2HJvHwcJejj/aPFf+g3iMDcY0O67nMuaj7aUtWswClNLW6mdlG5ThzeAwGH 0hDVabld3B5XHbNQebcc4dJ/nHLD0T+lP0B+OHv/3fY0gKFH+tcRw0zKkySPCCZ5OM9d f8Z8PibHVvKo9ab7zuC/u8JhdzJ33I3KimAGvdJenvKTatQ6EbleVbIYNofJR8XYYF1O FALw== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=d17BUbT9BeIhozRgLya99QrlVVsu5JDoV05HFzpYDyI=; b=kYpb8KCbAjHARDKOPeWgqJQxk2W7c1045u5hbmtaxSophsSVMAS9pdgG1MzzRmeb3e YreaQUZlSx8P2nugl8z8FvYaF+oIv5LLhssifVX4KMHT3XRd6d+9c9t4ly89swMsDy0U t6xXCzgP/HTxC8pqp+wB+gDrU87ltbMWMdq3VTBOE0EmLfYvePJDylR/tfA8D9I0o08T p2ONq7SNn9wTA5Tp3fKVecusJUImpkhH27F6cvpW0NDI71L00+J2Di54nhNuopxc66vy hDoAsxt14fzRoTvG9rRKIOilY3vNY9pnjYw3OhpuH9EGTmFgPnbcH47EALkMzMAVCo23 4ZDw== X-Gm-Message-State: APjAAAWzlXBx+VLqXzfROZWWmm8cp1uimUmNCcpC8l8/vLTQW05aNpI6 CRouIQwhnbHv7pNK27WxawOThw== X-Google-Smtp-Source: APXvYqzkJT+9NfIMSJwyBdAUhvFLgxMSJMdeZTpH6ySLbj3mVts+tjLm4Pji5DqLD/oefGUw4ie0hg== X-Received: by 2002:aa7:86c2:: with SMTP id h2mr50096222pfo.45.1582528839386; Sun, 23 Feb 2020 23:20:39 -0800 (PST) Received: from localhost ([45.127.44.57]) by smtp.gmail.com with ESMTPSA id p24sm11375421pff.69.2020.02.23.23.20.38 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Sun, 23 Feb 2020 23:20:38 -0800 (PST) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [RFC PATCH v5 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Date: Mon, 24 Feb 2020 12:50:26 +0530 Message-Id: X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Sender: linux-arm-msm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-arm-msm@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. cpus, gpus) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria --- .../thermal/thermal-cooling-devices.yaml | 114 ++++++++++++++++++ 1 file changed, 114 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 000000000000..6aafca25af9b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,114 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include + #include + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + }; +... 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The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria --- .../bindings/thermal/thermal-zones.yaml | 302 ++++++++++++++++++ 1 file changed, 302 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml new file mode 100644 index 000000000000..bc1ce8e41324 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml @@ -0,0 +1,302 @@ +# SPDX-License-Identifier: (GPL-2.0 OR MIT) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or artively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + thermal-zones: + type: object + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link thermal sensor devices, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + + properties: + $nodename: + pattern: "^[a-zA-Z][a-zA-Z0-9,\\-]{1,12}-thermal$" + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of thermal sensor phandles and sensor specifiers used to + monitor this thermal zone. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to takes action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9,+\\._]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. + + type: + oneOf: + - items: + - enum: + - active + - passive + - hot + - critical + description: | + There are four valid trip types, + - active - enable active cooling e.g. fans + - passive - enable passive cooling e.g. throttling cpu + - hot - send notification to driver if .notify + callback registered + - critical - send notification to driver if .notify + callback registered and trigger a shutdown + + required: + - temperature + - hysteresis + - type + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[0-9][-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + maximum: 100 + description: + The contribution of the cooling devices at the trip + temperature, both referenced in this map, to this thermal + zone as a percentage. + + required: + - trip + - cooling-device + +examples: + - | + #include + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = ; + interrupt-names = "uplow"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU1 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU2 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU3 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + + map1 { + trip = <&cpu0_alert1>; + cooling-device = <&CPU0 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU1 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU2 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>, + <&CPU3 THERMAL_NO_LIMIT + THERMAL_NO_LIMIT>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-thermal-top { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +...