From patchwork Fri Apr 3 07:01:46 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11471913 X-Patchwork-Delegate: daniel.lezcano@linaro.org Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id D1D5E15AB for ; Fri, 3 Apr 2020 07:02:03 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id A66C5214D8 for ; Fri, 3 Apr 2020 07:02:03 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="TvfXeIBa" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S2388901AbgDCHCC (ORCPT ); Fri, 3 Apr 2020 03:02:02 -0400 Received: from mail-pl1-f196.google.com ([209.85.214.196]:36597 "EHLO mail-pl1-f196.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S2388689AbgDCHCB (ORCPT ); Fri, 3 Apr 2020 03:02:01 -0400 Received: by mail-pl1-f196.google.com with SMTP id g2so2361815plo.3 for ; Fri, 03 Apr 2020 00:01:59 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=6x3raJsWJrKBOs4KmDhl3DHzaY6d4WRAbl46YPhMahs=; b=TvfXeIBa30JUm4/yO+K2Y3WiNj+8gvaEw+eZ/ORQgbnxUPkb/bXsI/mMkjOJ0iMZap sjDs170Wt4iFY6vnpwFJk4ZlRjsgIpbgfS951YM5+hjnzTxaQLf4oEyEt7j5cD+hoIcA 8RnzuevlG/yQ6z/2g/AUIeCmb83XbuhhFDaAWdfBbL0MfwTBcr1efVYrZwzd4NJIO4Lq dVhaMsFnYrnC+iY5zvmtZTiUZp8c5WL5okSo7jnXcrqrJO3zUvWYmvXcr0eSE0NC39Ve BatwD+9kYwXyOgd0LYtTgTecHJEGesqRa/BjPyraJeYi6k+u4U9BPBIhk/E8L14s18L4 yhxg== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=6x3raJsWJrKBOs4KmDhl3DHzaY6d4WRAbl46YPhMahs=; b=h+az3Lq6FtW+v8m7AvATFFQk5q/Ltb+3Mto/mIeZMC2yODLkWjlh4h2LY32QODyxZY 9aoAXkKHcIzqUAknrgcTRJ1qleOBfoXc7ag26cR9XRrla81rl5G6t0oXyGRAe9+LCCCb uUW0nJTB6vsNdZzOH9ZDE9BMnvlBHKbGPGF6hDOtwUpA8xqGK2HRbJTtxvRZhvhMQiem GyMXApAy+axVdbtE+Wy05yPkMDqSpe/yxZcjs34hshltZ/zl6AjfdriCpqlS/+Yjp8N/ pTwlgOADR1yVfP6qy3YkJGIU6j0Zg0mZ+OJfDSmeo4o+IWOMVHabDhUDOxXvxSbgEu8W 5R+w== X-Gm-Message-State: AGi0PuanFKBNnn63Q/QvgpMXKzbH7vaGTrR3d5eC27Ys1EPVw5q9S06f v5KXD20FSr/cGLy0ZNRQdiePXA== X-Google-Smtp-Source: APiQypLH2xma3A/qCqnkzFp+pxTjvIbI9dx5dmYQp68ewi2c/AYzvdEjeRX97EIuL2QUocN7/X37PQ== X-Received: by 2002:a17:902:7c89:: with SMTP id y9mr6424581pll.49.1585897319187; Fri, 03 Apr 2020 00:01:59 -0700 (PDT) Received: from localhost ([45.127.44.53]) by smtp.gmail.com with ESMTPSA id a24sm5195500pfl.115.2020.04.03.00.01.57 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Fri, 03 Apr 2020 00:01:58 -0700 (PDT) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, lukasz.luba@arm.com, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: Rob Herring , linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [PATCH v5 1/3] dt-bindings: thermal: Add yaml bindings for thermal sensors Date: Fri, 3 Apr 2020 12:31:46 +0530 Message-Id: X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria Reviewed-by: Rob Herring Reviewed-by: Lukasz Luba --- .../bindings/thermal/thermal-sensor.yaml | 72 +++++++++++++++++++ 1 file changed, 72 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 0000000000000..fcd25a0af38c9 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,72 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; +... From patchwork Fri Apr 3 07:01:47 2020 Content-Type: text/plain; charset="utf-8" MIME-Version: 1.0 Content-Transfer-Encoding: 7bit X-Patchwork-Submitter: Amit Kucheria X-Patchwork-Id: 11471917 X-Patchwork-Delegate: daniel.lezcano@linaro.org Return-Path: Received: from mail.kernel.org (pdx-korg-mail-1.web.codeaurora.org [172.30.200.123]) by pdx-korg-patchwork-2.web.codeaurora.org (Postfix) with ESMTP id 2F9DA92A for ; Fri, 3 Apr 2020 07:02:06 +0000 (UTC) Received: from vger.kernel.org (vger.kernel.org [209.132.180.67]) by mail.kernel.org (Postfix) with ESMTP id 02DD621582 for ; Fri, 3 Apr 2020 07:02:06 +0000 (UTC) Authentication-Results: mail.kernel.org; dkim=pass (2048-bit key) header.d=linaro.org header.i=@linaro.org header.b="qbq2T0rX" Received: (majordomo@vger.kernel.org) by vger.kernel.org via listexpand id S2388689AbgDCHCF (ORCPT ); Fri, 3 Apr 2020 03:02:05 -0400 Received: from mail-pg1-f194.google.com ([209.85.215.194]:35649 "EHLO mail-pg1-f194.google.com" rhost-flags-OK-OK-OK-OK) by vger.kernel.org with ESMTP id S2388302AbgDCHCE (ORCPT ); Fri, 3 Apr 2020 03:02:04 -0400 Received: by mail-pg1-f194.google.com with SMTP id k5so3097029pga.2 for ; Fri, 03 Apr 2020 00:02:04 -0700 (PDT) DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=linaro.org; s=google; h=from:to:cc:subject:date:message-id:in-reply-to:references :mime-version:content-transfer-encoding; bh=TovlFSqP+LvCTVbEbiC0GqlPPnwZVGxe7En1uRnnnvQ=; b=qbq2T0rXbHmgO7X9Tru81R27QTNRp7Edb0a827EuRQJzslw070mK0AxF4oreSvB5Fz NNcLMEzKPkTFU70s20W0ApdhcLCRY/6kNa8V4ewSNFt49LDa+ClqGq+f0cNcuRcwF3CC 9mHEMUri1ikEPIaReyEqbhBOOayT2D01LoWNF7psBsarleNs2t1WjikjmOxsDJskU/gY KQEgfKKaWOBjBogRFDLmpu5j8L0nqPBnpEkUYGB1VhM+ZfIjLVgllFb9CBrF3yJi6eqz zNjqNDpSbEsFst/kHrg0CtfckjuUCteGc/S6ObBZxzbbgVANt2/PmLlDkf5zlvIprhGC AqhA== X-Google-DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=1e100.net; s=20161025; h=x-gm-message-state:from:to:cc:subject:date:message-id:in-reply-to :references:mime-version:content-transfer-encoding; bh=TovlFSqP+LvCTVbEbiC0GqlPPnwZVGxe7En1uRnnnvQ=; b=MMwtwKfUukl+ULK0tiudRgReg4VnEt1MqRCQ3xLteXoofjHx0KwlqS+5j/vOICbPo3 GZzYeVLxDmuEmRmTscsT8afZ4PkuE3qZdnvo3cDfNXHNySxX4L/8NtDYWjX70PjOoiJ8 nDO0xObDHY3YZlls3JHl//fvqT2VrwRnkFN9qTqe9ekFiuQEHCPxDPFJUX3tmgL24IfO ife1VP5K3EQ9mGVUt7tuU6L/pA7OBmVsNjr16j/qeso5Zcq/ZQ+ZgyOOugxzP7eEk06n 3dnHIKYAx1cXEzJ+ROPGDdXOhr25+aQ7QIbhkhT+efSIgD0Ypu2DRNkYdoBMoPOHurCo zo6Q== X-Gm-Message-State: AGi0PubXqvWSy4w6UnnxuRwZOZlXLKM0c99NDGJXrx2avdwokqv062L/ ekHbuDGH6gmnpTst5k5hOUzrzA== X-Google-Smtp-Source: APiQypJ0GxjNSijwRL7Z7sOkijFoBozlKLOCy9QUU8Q6ytcrjpF6mG5T9MuJeG4FwW2M4bKOs+tt+A== X-Received: by 2002:a63:ec44:: with SMTP id r4mr6591690pgj.425.1585897323639; Fri, 03 Apr 2020 00:02:03 -0700 (PDT) Received: from localhost ([45.127.44.53]) by smtp.gmail.com with ESMTPSA id c190sm5132826pfa.66.2020.04.03.00.02.01 (version=TLS1_3 cipher=TLS_AES_256_GCM_SHA384 bits=256/256); Fri, 03 Apr 2020 00:02:02 -0700 (PDT) From: Amit Kucheria To: linux-kernel@vger.kernel.org, linux-arm-msm@vger.kernel.org, swboyd@chromium.org, lukasz.luba@arm.com, mka@chromium.org, daniel.lezcano@linaro.org, Amit Kucheria , Zhang Rui Cc: Rob Herring , linux-pm@vger.kernel.org, devicetree@vger.kernel.org Subject: [PATCH v5 2/3] dt-bindings: thermal: Add yaml bindings for thermal cooling-devices Date: Fri, 3 Apr 2020 12:31:47 +0530 Message-Id: <7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org> X-Mailer: git-send-email 2.20.1 In-Reply-To: References: MIME-Version: 1.0 Sender: linux-pm-owner@vger.kernel.org Precedence: bulk List-ID: X-Mailing-List: linux-pm@vger.kernel.org As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. CPUs, GPUs) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria Reviewed-by: Rob Herring Reviewed-by: Lukasz Luba --- .../thermal/thermal-cooling-devices.yaml | 116 ++++++++++++++++++ 1 file changed, 116 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 0000000000000..5145883d932e6 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,116 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +select: true + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include + #include + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>; + }; + }; + }; + + /* ... */ + }; +... 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The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria Reviewed-by: Rob Herring Reviewed-by: Lukasz Luba --- .../bindings/thermal/thermal-zones.yaml | 341 ++++++++++++++++++ 1 file changed, 341 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml new file mode 100644 index 0000000000000..b8515d3eeaa2b --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml @@ -0,0 +1,341 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + $nodename: + const: thermal-zones + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link a thermal sensor device, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + +patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$": + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + maxItems: 1 + description: + The thermal sensor phandle and sensor specifier used to monitor this + thermal zone. + + coefficients: + $ref: /schemas/types.yaml#/definitions/uint32-array + description: + An array of integers containing the coefficients of a linear equation + that binds all the sensors listed in this thermal zone. + + The linear equation used is as follows, + z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn + where c0, c1, .., cn are the coefficients. + + Coefficients default to 1 in case this property is not specified. The + coefficients are ordered and are matched with sensors by means of the + sensor ID. Additional coefficients are interpreted as constant offset. + + sustainable-power: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An estimate of the sustainable power (in mW) that this thermal zone + can dissipate at the desired control temperature. For reference, the + sustainable power of a 4-inch phone is typically 2000mW, while on a + 10-inch tablet is around 4500mW. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to take action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + minimum: -273000 + maximum: 200000 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. Any cooling action initiated by the framework is + maintained until the temperature falls below + (trip temperature - hysteresis). This potentially prevents a + situation where the trip gets constantly triggered soon after + cooling action is removed. + + type: + $ref: /schemas/types.yaml#/definitions/string + enum: + - active # enable active cooling e.g. fans + - passive # enable passive cooling e.g. throttling cpu + - hot # send notification to driver + - critical # send notification to driver, trigger shutdown + description: | + There are four valid trip types: active, passive, hot, + critical. + + The critical trip type is used to set the maximum + temperature threshold above which the HW becomes + unstable and underlying firmware might even trigger a + reboot. Hitting the critical threshold triggers a system + shutdown. + + The hot trip type can be used to send a notification to + the thermal driver (if a .notify callback is registered). + The action to be taken is left to the driver. + + The passive trip type can be used to slow down HW e.g. run + the CPU, GPU, bus at a lower frequency. + + The active trip type can be used to control other HW to + help in cooling e.g. fans can be sped up or slowed down + + required: + - temperature + - hysteresis + - type + additionalProperties: false + + additionalProperties: false + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + maximum: 100 + description: + The percentage contribution of the cooling devices at the + specific trip temperature referenced in this map + to this thermal zone + + required: + - trip + - cooling-device + additionalProperties: false + + required: + - polling-delay + - polling-delay-passive + - thermal-sensors + - trips + additionalProperties: false + +examples: + - | + #include + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1400MHz in OPP table */ + cooling-device = <&CPU0 3 3>, <&CPU1 3 3>, + <&CPU2 3 3>, <&CPU3 3 3>; + }; + + map1 { + trip = <&cpu0_alert1>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>, <&CPU1 5 5>, + <&CPU2 5 5>, <&CPU3 5 5>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-top-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +...